Patents by Inventor Ronald Jack Smith

Ronald Jack Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10343634
    Abstract: An apparatus includes a vehicle structure, a bumper, an elongate structural member, and an extension portion. The elongate structural member is able to crush longitudinally in response to application of force in a longitudinal direction. The extension portion is able to crush longitudinally in response to application of force in the longitudinal direction, is connected to the elongate structural member such that the elongate structural member and the extension portion support the bumper with respect to the vehicle structure, and is operable to move the bumper between an extended position and a retracted position with respect to the vehicle structure to change a distance between the bumper and the vehicle structure.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: July 9, 2019
    Assignee: Apple Inc.
    Inventors: Erik Mikael Fermer, Alice C. Watts, Joel Frederic Jensen, Ronald Jack Smith, Mark B. Rober, Sung Hoon Kim, David Jennings Dostal, Russell Cranstoun Mead, Jr., Todd Elliot Lewis, Jesse T. Buehler, Nathaniel J. Dennis, Tommaso P. Rivellini, Robert R. Mayer, Anthony S. Montevirgen, Donald J. Parr, Bryce A. Woollard, Adam J. Golman, Kevin P. Makowski, Daniel E. Rivera
  • Patent number: 7440281
    Abstract: An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
    Type: Grant
    Filed: February 1, 2006
    Date of Patent: October 21, 2008
    Assignee: Apple Inc.
    Inventors: Sean Ashley Bailey, Richard Lidio Blanco, Jr., David Edwards, Supratik Guha, Michael David Hillman, Yves C. Martin, Phillip Lee Mort, Roger Schmidt, Prabjit Singh, Ronald Jack Smith, Gregory L. Tice, Theodore Gerard van Kessel
  • Patent number: 6132019
    Abstract: A door assembly that includes a door that is operable to alternatively expose and cover an opening in the bezel of a computer. The door assembly includes a carriage that slides up and down that pivotally couples to the door. Upon pressing against the lower portion of the door, the door pivots and the carriage and the door automatically slide down such that the door no longer covers the opening in the bezel. When an upward force is applied to the door, the door and the carriage move upward and into the closed position. As the door reaches the opening in the bezel, a spring forces the door against the bezel and into the closed position. The door is easily opened and closed and the door is out of the way when the door is in the open position.
    Type: Grant
    Filed: August 11, 1999
    Date of Patent: October 17, 2000
    Assignee: Silicon Graphics, Inc.
    Inventors: Sung Kim, Colin Alexander Davis, Ronald Jack Smith, Steven G. Siefert