Patents by Inventor Ronald James Weachock

Ronald James Weachock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package including wire bonds
    Patent number: 7888257
    Abstract: It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 ?m or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the bonding wire and bonding pad that are not passivated and that promote corrosion. Avoidance of crevice formation through, for example, appropriately choosing the bonding pad and wire configuration substantially avoids such corrosion.
    Type: Grant
    Filed: October 10, 2007
    Date of Patent: February 15, 2011
    Assignee: Agere Systems Inc.
    Inventors: Joze Eura Antol, John William Osenbach, Ronald James Weachock
  • Integrated circuit package including wire bonds
    Publication number: 20090098687
    Abstract: It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 ?m or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the bonding wire and bonding pad that are not passivated and that promote corrosion. Avoidance of crevice formation through, for example, appropriately choosing the bonding pad and wire configuration substantially avoids such corrosion.
    Type: Application
    Filed: October 10, 2007
    Publication date: April 16, 2009
    Inventors: Joze Eura Antol, John William Osenbach, Ronald James Weachock