Abstract: An improved spatial light modulator package comprising a spatial light modulator 1006 attached to a central region of a substrate 1004, a sealing ring 1002 on said substrate 1004 around the central region thereof, a window frame 402 attached to the sealing ring 1002, and a window 404 glued to the window frame 402. Gluing the window 404 to the window frame 402 avoids distortion of the glass that occurs when the window is heat bonded to the window frame, and avoids having to grind and polish the glass window after it is bonded to the window frame.

Abstract: A method of passivating a hermetically sealed micromechanical device (14) with a passivant (100). A predetermined quantity of the passivant (100) is placed within the cavity (54) of a lid (42) after the lid and package base (46) have been activated. Thereafter, by heating the package (10) including the passivant, the passivant will sublime within the hermetically sealed package (10) to provide a monolayer of passivant across the active surfaces of the micromechanical die (14). An improved hermetic seal is achieved since the passivant is sublimed after the laser weld process. In addition, the effectiveness of the passivation process is improved since the passivation is performed after the package is sealed, without the risk of any impurities entering into the package to degrade the effectiveness of the passivation.