Abstract: Methods are disclosed of assembling a food package using an absorbent pad having an active agent that generates an atmosphere-modifying gas into the headspace after the food package is sealed, to compensate for losses of atmosphere-modifying gases injected in the food package prior to sealing. The methods of assembly reduce the headspace requirements and overall dimensions of the food package. The methods further prevent or reduce collapse of the food package or having the lid film contact the food product.

Abstract: The present disclosure relates to an absorbent pad with a layered architecture that is adapted for absorbing liquids in trash receptacles that masks or suppresses odors therein. The present disclosure also provides a method of using an absorbent pad to absorb trash liquids to reduce or mask odors, delay spoilage of food wastes, and repel rodents or other pests.

Abstract: A body bag for water retrieval of human remains is provided. The body bag is lightweight and disposable. The body bag is made of a material having a hole ratio per unit weight of material in a particular range that permits rapid water drainage yet provides sufficient strength and integrity to the body bag, and reduces cross-contamination. The body bag can have a skid pad on an exterior surface as an aid to lifting the body bag out of the water and over the gunwale or sides of a recovery vehicle. The body bag also can have large handles for ease of gripping and to attach buoyancy devices. The body bag further can have a snag line around its periphery.

Abstract: The present disclosure is directed to an absorbent pad having a mechanism for theft detection and deterrence, and/or inventory control, including product tracking. The mechanism is positioned at an edge of the pad, thereby maintaining effectiveness, even when the pad is covered by a food product or exposed to a dielectric effect created by food liquids or salts in the package.

Abstract: An absorbent pad that can be removably connected to a transporter on which an injured person is carried is provided. Structures for removably attaching the absorbent pad to the transporter are described. Also provided are a transporter having a removable absorbent pad and a method for placing a removable absorbent pad on a transporter.

Abstract: The present disclosure is a lightweight, absorbent body bag. The body bag is portable and disposable. The body bag has a backing substrate, an absorbent body, a cover with a recloseable flap that can be opened and closed to permit a body to be placed within and removed from the body bag, and gripping devices along the edges to permit easy transportation. A thermal seal may be applied continuously along a perimeter of the body bag to create a water-resistant body compartment. The present disclosure also includes a method for using the body bag and a body bag kit.

Abstract: A lightweight, portable transporter for carrying a person having anti-hypothermia structures and an absorbent body is provided. The transporter has a backing substrate, an absorbent body, a gripping device, and anti-hypothermia structures, such as material segments or covers that reduce loss of body heat of the person being carried on the transporter. A method of using the transporter is provided.

Abstract: The present disclosure provides a method of packaging a continuous length of a product or material in a container using rows or layers that are indexed a pre-determined distance when placed on a previous row or layer. The method permits an end-user to dispense the entire contents of a container with one set-up, and eliminates the need to splice within the box to obtain a continuous supply of the product. The indexed layers form horizontal layers that provide stability and balance to the container while the product or material is dispensed by an end-user. Indexed layers provide a natural separation plane between adjacent layers so that the product or material can be dispensed more quickly. A container that is packaged and filled using indexed rows or layers of a product or material by the method is also disclosed.

Abstract: The present disclosure is directed to an absorbent pad having an active agent to preserve food products or other perishable merchandise, that has a pad architecture, including the specific arrangement of the absorbent layers and active agents in the absorbent pad, that affects the availability and timing of release of the active agents to preserve the freshness of food products that are stored at home by a consumer in the consumer's own food storage containers.

Abstract: The present disclosure is a disposable transporter that is absorbent, portable, and lightweight, and having sufficient strength to carry an injured soldier or medical patient. The transporter has a backing substrate, absorbent body, and gripping device. The gripping device permits manual carrying or insertion of poles to form a litter or portable cot. The absorbent body may have active agents that kill microorganisms to reduce the risk of contamination, infection, and odors from blood or other body fluids. The disclosure provides a process for producing base materials for the transporter. Also disclosed is a transporter kit having a transporter and a water-resistant case.

Abstract: The present disclosure is directed to a consumer food storage package to preserve the freshness of food, having an absorbent food pad positioned within a food storage container. The container or absorbent food pad can have a securing means, so that the pad can be positioned in place in the food storage container. Also disclosed is a method for using the food storage package to preserve the freshness of food.

Abstract: A design for stacking integrated circuits is described. Some integrated circuits have multiple signal pads that are common between a top integrated circuit and a bottom integrated circuit in an integrated circuit pair. These common pads are placed symmetrically on the integrated circuit. Unique signal pads are provided independently to each integrated circuit in a stack. An optional array of solder bumps placed over a central area of the integrated circuit may be used, which provides for heat transfer through the stack. When stacking multiple pairs of integrated circuits, the top integrated circuit in the integrated circuit stack pair serves as a spacer between the first and second pair of integrated circuits.

Abstract: The present invention provides a reinforced absorbent article that includes one or more reinforcement means. The reinforced absorbent article allows for the use of high-speed processing without machinery malfunction and downtime. In one embodiment the reinforced absorbent article is a reinforced absorbent food pad.

Abstract: The present invention provides new probes for the detection of prostate cancer cells. The probes bind selectively with target polynucleotide sequences selected from the group consisting of 2q, 4q, 5q, 6q, 10p, 15q, 1q, 2p, 3q, 3p, 4q, 6p, 7p, 7q, 9q, 11p, 16p, and 17q.

Abstract: A method and system for stacking integrated circuits is described. An integrated circuit stack is formed by stacking integrated circuit pairs. The integrated circuit pairs are formed by connecting an active surface of a first integrated circuit to an active surface of a second integrated circuit using flip chip bonding. The first integrated circuit pair is connected to a substrate using an adhesive. The other integrated circuit pairs are stacked sequentially on the first integrated circuit pair using an adhesive. Wire bonding is used to connect the second integrated circuit in each of the integrated circuit pairs to the substrate.

Abstract: Methods and apparatus for vertical die chip-on-board sensor packages are provided. Such vertical die chip-on-board sensor packages can comprise a vertical sensor circuit component comprising a first face, a second face, a bottom edge, a top edge, two side edges, input/output (I/O) pads and at least one sensitive direction wherein the I/O pads are arranged near the bottom edge. Such vertical die chip-on-board sensor packages can also comprise one or more horizontal sensor circuit components comprising a top face, a printed circuit board (PCB) mounting face, a vertical sensor circuit component interface edge, two or more other edges, and one or more sensitive directions wherein the vertical sensor circuit component interface edge supports the vertical sensor circuit component along the Z axis and conductively or non-conductively connects to the vertical sensor circuit component.