Abstract: An LED device holder, an LED lighting system and a method of manufacturing an LED lighting system are described herein. An LED lighting system includes a holder defining an aperture. The aperture has a perimeter and a fillet adjacent the perimeter. The fillet has a radius greater than or equal to 2.0 mm and less than or equal to 4.6 mm. An LED array is mechanically coupled to the holder. The LED array has a light emitting surface exposed through the aperture.

Abstract: LED lighting systems and vehicle headlamp systems are described. An LED lighting system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces. First redistribution layers are provided on the top surface of the silicon backplane and the top surface of the substrate. Second redistribution layers are provided on the bottom surface of the silicon backplane and the bottom surface of the substrate. At least one via extends through the substrate between the first redistribution layers and the second redistribution layers and is filled with a metal material.

Abstract: Methods of manufacturing a system are described. A method includes attaching a silicon backplane to a carrier and molding the silicon backplane on the carrier such that a molding material surrounds side surfaces of the silicon backplane to form a structure comprising a substrate with an embedded silicon backplane. The structure has a first surface opposite the carrier, a second surface adjacent the carrier, and side surfaces. At least one via is formed through the molding material and filled with a metal material. A metal layer is formed on a central region of the first surface of the structure. Redistribution layers are formed on the first surface of the structure adjacent the metal layer.

Abstract: Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.

Abstract: A control system for an LED array relies on defining a first and a second group of separately addressed LED pixels, with the first group including pixels with an average current no less than the current at a Q point and a second group including pixels with an average current less than the current at a Q point. An amplitude signal provided to the first group of separately addressed LED pixels is selectively modulated, while providing a DC mode 100% duty cycle. An amplitude signal provided to the second group of separately addressed LED pixels is fixed, and a modulated duty cycle is provided.

Abstract: An LED device holder, an LED lighting system and a method of manufacturing an LED lighting system are described herein. An LED lighting system includes a holder defining an aperture. The aperture has a perimeter and a fillet adjacent the perimeter. The fillet has a radius greater than or equal to 2.0 mm and less than or equal to 4.6 mm. An LED array is mechanically coupled to the holder. The LED array has a light emitting surface exposed through the aperture.

Abstract: An LED device holder, an LED lighting system and a method of manufacturing an LED lighting system are described herein. An LED lighting system includes a holder defining an aperture. The aperture has a perimeter and a fillet adjacent the perimeter. The fillet has a radius greater than or equal to 2.0 mm and less than or equal to 4.6 mm. An LED array is mechanically coupled to the holder. The LED array has a light emitting surface exposed through the aperture.

Abstract: An LED device holder, an LED lighting system and a method of manufacturing an LED lighting system are described herein. An LED lighting system includes a holder defining an aperture. The aperture has a perimeter and a fillet adjacent the perimeter. The fillet has a radius greater than or equal to 2.0 mm and less than or equal to 4.6 mm. An LED array is mechanically coupled to the holder. The LED array has a light emitting surface exposed through the aperture.