Abstract: Touch sensitive projection screens are disclosed. In particular, touch sensitive projection screen including drive electrodes, sense electrodes, and optical diffusers are disclosed. The touch sensitive projection screens are adapted for use on a horizontal surface. Touch sensitive projection screens including shrinkable layers are also disclosed.

Abstract: A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being electrically connected to the die by the copper leads.

Abstract: A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being electrically connected to the die by the copper leads.

Abstract: Provided is a means of improving the adhesion between a flexible circuit coverfilm and an encapsulant material in an inkjet printer application.

Abstract: Disclosed is a method for making long flexible circuits. Some of the long circuits may be made using a single photoimaging mask. Also disclosed are flexible circuits made by this method.

Abstract: A circuit article for use with an inkjet printer pen. The circuit article comprises a flexible circuit having a plurality of conductive traces disposed on a dielectric film, an adhesive film disposed adjacent the dielectric film of the flexible circuit, and a carrier film disposed adjacent the first adhesive film, opposite of the flexible circuit. The adhesive film is derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent.

Abstract: Disclosed is a method for making long flexible circuits. Some of the long circuits may be made using a single photoimaging mask. Also disclosed are flexible circuits made by this method.

Abstract: A circuit article for use with an inkjet printer pen. The circuit article comprises a flexible circuit having a plurality of conductive traces disposed on a dielectric film, an adhesive film disposed adjacent the dielectric film of the flexible circuit, and a carrier film disposed adjacent the first adhesive film, opposite of the flexible circuit. The adhesive film is derived from a cross-linkable precursor comprising an epoxidized aromatic-diene block copolymer and a thermal-curing agent.

Abstract: An electronic circuit device comprising at least one substrate having a photoimageable covercoat, comprising at least 95 weight percent of at least one epoxy-modified aromatic vinyl-conjugated diene block copolymer and a catalyst comprising an onium salt selected from a triarylsulfonium salt and a diaryliodonium salt, wherein the covercoat is formed by solvent coating or extrusion and then heat laminated onto at least a portion of the substrate.

Abstract: An electronic circuit device comprising at least one substrate having a photoimageable covercoat, comprising at least 95 weight percent of at least one epoxy-modified aromatic vinyl-conjugated diene block copolymer and a catalyst comprising an onium salt selected from a triarylsulfonium salt and a diaryliodonium salt, wherein the covercoat is formed by solvent coating or extrusion and then heat laminated onto at least a portion of the substrate.

Abstract: Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film.

Abstract: Discrete computational elements are provided that will be connected to a base unit, and to one another or I/O devices, in order to configure a particular computer system. The base unit provides the electrical power required to energize the computational elements. A plurality of identically configured substrates are joined in a layered relation and are electrically connected with one another. These substrates are capable of being fabricated of different lengths such that they can extend outwardly from the computational element and may be connected to other computational elements. At least one integrated circuit will be placed on one side of the joined substrates and is electrically connected to each substrate layer. In this manner the ICs will be able to communicate with chips on other computational elements.

Abstract: A method and system for manufacturing electrically isolated vias in a flexible substrate composed of a metal core laminated by layers of an organic material. The method includes the steps of etching via holes, hydrolyzing the inner organic surfaces of the via holes and baking a polyimide solution coated in the via holes.

Abstract: A chip overlay element is formed of a flexible substrate of polymer having electrically conductive material applied to one side thereof and circuitized to form signal lines. A metal stiffener/heat spreader is laminated to the polymer on the opposite side of the conductor. I/Os are formed on one end of the signal lines of the circuitized layer (near the end of the overlay element) and interconnection pads, bumps, or the like are formed on the opposite end (near the center of the element). The metal stiffener is then etched to form three distinct areas. The chip edge is then placed on the center metal stiffener area and bonded, with the other two stiffener areas being bent around the chip and bonded to the corresponding chip sides. The original I/Os are then electrically connected to the I/Os formed on the signal lines of the overlay element.

Abstract: A method and system are provided for forming apertures in the dielectric layers of an aluminum circuit to allow electrical connection to the aluminum core and enhance the thermal efficiency of integrated circuit devices attached thereto. Specifically, the apertures are formed to accommodate the ICs and allow them to be in direct contact with the aluminum core layer of the circuit card. The apertures are formed by placing a photoresist material on the aluminum core in locations corresponding to the desired locations of the aperture. The photoresist material is used as a "placeholder" during subsequent processing. The aluminum is then anodized to form aluminum oxide and a polymer material is then electrophoretically placed over the aluminum oxide. The photoresist "placeholder" is then removed, leaving an aperture that will accommodate an IC. The top of the polymer layer can then be circuitized to interconnect the chips.

Abstract: Substrate layers with individual bumps and cavities are provided which can be manufactured and tested in parallel and then joined into a multilayer substrate. The method of manufacturing these layers, as contemplated by the present invention, includes initially forming a plurality of vias in a layer of electrically conductive material. Next, a dielectric material, is placed adjacent the layer of conductive material. Holes which are coaxial with the vias are then formed in the dielectric material. Electrically conductive material is then deposited within the vias, thereby forming a conductive stud. Additional electrically conductive material is then deposited, on the side of the dielectric opposite the conductive material to form a signal layer, as well projections of electrically conductive material extending from the studs. A continuous layer of dielectric material is then placed adjacent the side of the substrate opposite the projections.

Abstract: A multilayer, flexible substrate upon which integrated circuit chips can be attached is disclosed. The input/output(I/O) connections from the chip do not radiate outward from the side of the die, but rather extend from a bottom surface. Since the I/O signal lines would not be accessible for testing once the IC chip is mounted on a substrate, each I/O line is extended outward from the IC footprint to an area on the substrate which is accessible. Additionally, an electrical path from each I/O signal port is simultaneously passed through the substrate layers upon which the chip is mounted, thus providing electrical contact of all I/O ports to the underside of the flexible substrate.An integrated circuit chip is mounted on this flexible substrate. Since each I/O line is accessible after mounting, the IC chip can be tested prior to mounting on its ultimate carrier. Once tested, the IC chip and the substrate upon which it is mounted are excised from the roll of substrate material.

Abstract: An interconnect strip is provided for effecting electrical interconnection between pluralities of conductor pads disposed on circuit boards or the like in a high density configuration. The strip is fabricated from a polymer film carrier having laminated thereon a metal foil with preselected spring properties. After lamination, lithographic techniques from a series of electrically isolated metallic beams on the carrier. Additional chemical processing removes portions of the carrier at opposing sides of the strip to expose opposing ends of the beams which extend beyond the carrier parallel to one another in opposing directions outwards from the carrier. By urging the pads towards respective beam ends of the strip disposed between the pads until mating engagement therewith, a plurality of electrical interconnections are established through the beams.

Abstract: A system for providing low insertion force electrical interconnections between high density contacts for use in interconnecting circuit packages. A housing has disposed therein one or more pre-buckled beam connectors. Each connector has a resilient insulative strip carrying a plurality of buckling beams electrically isolated from each other. The beams are aligned on the plane defining the strip in parallel with ends extending away from the strip edges in opposing directions. Means are provided for deforming the strip within the housing prior to effecting desired interconnections whereby the beams are pre-buckled. Upon urging contacts into proximity with the beam ends, the buckling force is released causing each beam's ends to be urged away from the strip into engagement with respective contacts, thereby effecting desired interconnection between contacts and through one or more beams.