Patents by Inventor Ronald L. Koepp

Ronald L. Koepp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11024936
    Abstract: Methods of RFID tag assembly include affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 1, 2021
    Assignee: Impinj, Inc.
    Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
  • Patent number: 10885421
    Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. A substrate of the RFID IC, or a portion of the IC substrate, electrically couples the first circuit block to at least one of the first and second antenna contacts. The IC includes one or more interfaces or barrier regions that at least partially electrically isolate the first circuit block from the rest of the IC substrate.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: January 5, 2021
    Assignee: Impinj, Inc.
    Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver
  • Patent number: 10331993
    Abstract: A Radio Frequency Identification (RFID) integrated circuit (IC) is at least partially covered by a repassivation layer that is, in turn, at least partially covered by a large, electrically conductive contact pad. The repassivation layer is disposed so as to leave uncovered at least one IC contact. The large contact pad is disposed so as to cover the IC IC contact. The large contact pad forms a first galvanic coupling to the IC contact and a second galvanic coupling to a tag antenna. The surface area of the first galvanic coupling is substantially smaller than the surface area of the second galvanic coupling.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: June 25, 2019
    Assignee: Impinj, Inc.
    Inventors: Ronald L. Koepp, Harley K. Heinrich, Christopher J. Diorio, Tan Mau Wu
  • Patent number: 10311351
    Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. A substrate of the RFID IC, or a portion of the IC substrate, electrically couples the first circuit block to at least one of the first and second antenna contacts. The IC includes one or more interfaces or barrier regions that at least partially electrically isolate the first circuit block from the rest of the IC substrate.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: June 4, 2019
    Assignee: Impinj, Inc.
    Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver
  • Patent number: 10116033
    Abstract: RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: October 30, 2018
    Assignee: Impinj, Inc.
    Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
  • Patent number: 9875438
    Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: January 23, 2018
    Assignee: IMPINJ, INC.
    Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
  • Patent number: 9495631
    Abstract: A Radio Frequency Identification (RFID) IC may have raised contact islands that include conductive contact pads covering a repassivation layer. The raised contact islands are formed by removing part or all of the repassivation material surrounding the raised contact islands. The repassivation material that is not covered and protected by the contact pads may be removed by a strip process that also removes a masking layer used for IC etching. Singulated RFID ICs may be assembled into an RFID tag using a B-stage adhesive that is applied to the ICs and then partially cured. The ICs are deposited onto preheated inlays. The preheated inlays cause the B-stage adhesive on the ICs to bind to the inlays.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: November 15, 2016
    Assignee: IMPINJ INC.
    Inventors: Ronald L. Koepp, Harley K. Heinrich, Christopher J. Diorio, Tan Mau Wu
  • Patent number: 9489611
    Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.
    Type: Grant
    Filed: February 4, 2016
    Date of Patent: November 8, 2016
    Assignee: IMPINJ INC.
    Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
  • Patent number: 9317799
    Abstract: RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: April 19, 2016
    Assignee: IMPINJ, INC.
    Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
  • Publication number: 20150248604
    Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.
    Type: Application
    Filed: May 16, 2015
    Publication date: September 3, 2015
    Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
  • Publication number: 20150227832
    Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.
    Type: Application
    Filed: August 23, 2013
    Publication date: August 13, 2015
    Applicant: Impinj, Inc.
    Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
  • Patent number: 9053400
    Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: June 9, 2015
    Assignee: Impinj, Inc.
    Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
  • Patent number: 8796865
    Abstract: Radio Frequency Identification (RFID) tags are provided, along with apparatuses and methods for making. In some embodiments, the RFID tags include an RFID tag chip that is attached to an inlay and/or a strap. The inlay or strap has one or more contact bumps formed thereon. In some of these embodiments, the RFID tag chip includes pads for electrical contacts, but not chip-bumps, thanks to the contact bump.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: August 5, 2014
    Assignee: Impinj, Inc.
    Inventors: Jay M. Fassett, Ronald A. Oliver, Ronald L. Koepp, Steven I. Mozsgai, Ernest Allen, III
  • Publication number: 20140073071
    Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.
    Type: Application
    Filed: August 23, 2013
    Publication date: March 13, 2014
    Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
  • Publication number: 20140070010
    Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.
    Type: Application
    Filed: August 23, 2013
    Publication date: March 13, 2014
    Applicant: Impinj, Inc.
    Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
  • Patent number: 8661652
    Abstract: RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: March 4, 2014
    Assignee: Impinj, Inc.
    Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
  • Patent number: 8614506
    Abstract: Radio Frequency Identification (RFID) tags are provided, along with apparatuses and methods for making. In some embodiments, the RFID tags include an RFID tag chip that is attached to an inlay and/or a strap. The inlay or strap has one or more contact bumps formed thereon. In some of these embodiments, the RFID tag chip includes pads for electrical contacts, but not chip-bumps, thanks to the contact bump.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: December 24, 2013
    Assignee: Impinj, Inc.
    Inventors: Jay M. Fassett, Ernest Allen, III, Ronald L. Koepp, Ronald A. Oliver, Steven I. Mozsgai
  • Patent number: 8511569
    Abstract: A nonconductive, organic stabilization layer deposited on an RFID IC provides a consistent and predictable mounting distance between the RFID IC and its antenna layer or a strap, thereby ensuring a consistent and predictable mounting capacitance between circuits of the RFID IC and an antenna formed on the inlay or the strap. Openings in the stabilization layer enable electrical connection between the antenna pads of the RFID IC and the terminals of the inlay antenna or strap contacts through bumps formed on the antenna pads, through a conductive redistribution layer formed on the stabilization layer (when the inlay or strap is attached to the RFID IC by means of an anisotropic conductive layer), or through a capacitive connection to the inlay antenna or strap (when the inlay or strap is attached to the RFID IC by means of a nonconductive layer).
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: August 20, 2013
    Assignee: Impinj, Inc.
    Inventors: Ronald L. Koepp, Harley K. Heinrich, Christopher J. Diorio
  • Patent number: 8201748
    Abstract: A precursor for a Radio Frequency Identification (RFID) tag includes a conductive lead frame with at least three segments, an RFID Integrated Circuit (IC) with at least two antenna terminals, and at least two jumpers. The RFID IC is mounted on at least one of the segments. The antenna terminals are electrically coupled to at least two of the segments, and the jumpers electrically couple the segments such that the coupled segments form a two-turn coil between the antenna terminals of the RFID IC.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: June 19, 2012
    Assignee: Impinj, Inc.
    Inventors: Ronald L. Koepp, Ronald A. Oliver, Jay Fassett, Christopher J. Diorio
  • Publication number: 20100270382
    Abstract: A precursor for a Radio Frequency Identification (RFID) tag includes a conductive lead frame with at least three segments, an RFID Integrated Circuit (IC) with at least two antenna terminals, and at least two jumpers. The RFID IC is mounted on at least one of the segments. The antenna terminals are electrically coupled to at least two of the segments, and the jumpers electrically couple the segments such that the coupled segments form a two-turn coil between the antenna terminals of the RFID IC.
    Type: Application
    Filed: April 26, 2010
    Publication date: October 28, 2010
    Applicant: Impinj, Inc.
    Inventors: Ronald L. Koepp, Ronald A. Oliver, Jay Fassett, Christopher J. Diorio