Patents by Inventor Ronald L. Koepp
Ronald L. Koepp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11423278Abstract: A Radio Frequency Identification (RFID) integrated circuit (IC) is at least partially covered by a repassivation layer that is, in turn, at least partially covered by a large, electrically conductive contact pad. The repassivation layer is disposed so as to leave uncovered at least one IC contact. The large contact pad is disposed so as to cover the IC IC contact. The large contact pad forms a first galvanic coupling to the IC contact and a second galvanic coupling to a tag antenna. The surface area of the first galvanic coupling is substantially smaller than the surface area of the second galvanic coupling.Type: GrantFiled: March 23, 2021Date of Patent: August 23, 2022Assignee: Impinj, Inc.Inventors: Ronald L. Koepp, Harley K. Heinrich, Christopher J. Diorio, Tan Mau Wu
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Patent number: 11024936Abstract: Methods of RFID tag assembly include affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.Type: GrantFiled: October 23, 2018Date of Patent: June 1, 2021Assignee: Impinj, Inc.Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
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Patent number: 10885421Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. A substrate of the RFID IC, or a portion of the IC substrate, electrically couples the first circuit block to at least one of the first and second antenna contacts. The IC includes one or more interfaces or barrier regions that at least partially electrically isolate the first circuit block from the rest of the IC substrate.Type: GrantFiled: May 13, 2019Date of Patent: January 5, 2021Assignee: Impinj, Inc.Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver
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Patent number: 10331993Abstract: A Radio Frequency Identification (RFID) integrated circuit (IC) is at least partially covered by a repassivation layer that is, in turn, at least partially covered by a large, electrically conductive contact pad. The repassivation layer is disposed so as to leave uncovered at least one IC contact. The large contact pad is disposed so as to cover the IC IC contact. The large contact pad forms a first galvanic coupling to the IC contact and a second galvanic coupling to a tag antenna. The surface area of the first galvanic coupling is substantially smaller than the surface area of the second galvanic coupling.Type: GrantFiled: December 2, 2015Date of Patent: June 25, 2019Assignee: Impinj, Inc.Inventors: Ronald L. Koepp, Harley K. Heinrich, Christopher J. Diorio, Tan Mau Wu
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Patent number: 10311351Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. A substrate of the RFID IC, or a portion of the IC substrate, electrically couples the first circuit block to at least one of the first and second antenna contacts. The IC includes one or more interfaces or barrier regions that at least partially electrically isolate the first circuit block from the rest of the IC substrate.Type: GrantFiled: January 12, 2018Date of Patent: June 4, 2019Assignee: Impinj, Inc.Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver
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Patent number: 10116033Abstract: RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.Type: GrantFiled: February 11, 2016Date of Patent: October 30, 2018Assignee: Impinj, Inc.Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
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Patent number: 9875438Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.Type: GrantFiled: February 4, 2016Date of Patent: January 23, 2018Assignee: IMPINJ, INC.Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
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Patent number: 9495631Abstract: A Radio Frequency Identification (RFID) IC may have raised contact islands that include conductive contact pads covering a repassivation layer. The raised contact islands are formed by removing part or all of the repassivation material surrounding the raised contact islands. The repassivation material that is not covered and protected by the contact pads may be removed by a strip process that also removes a masking layer used for IC etching. Singulated RFID ICs may be assembled into an RFID tag using a B-stage adhesive that is applied to the ICs and then partially cured. The ICs are deposited onto preheated inlays. The preheated inlays cause the B-stage adhesive on the ICs to bind to the inlays.Type: GrantFiled: July 18, 2013Date of Patent: November 15, 2016Assignee: IMPINJ INC.Inventors: Ronald L. Koepp, Harley K. Heinrich, Christopher J. Diorio, Tan Mau Wu
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Patent number: 9489611Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.Type: GrantFiled: February 4, 2016Date of Patent: November 8, 2016Assignee: IMPINJ INC.Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
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Patent number: 9317799Abstract: RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.Type: GrantFiled: December 26, 2013Date of Patent: April 19, 2016Assignee: IMPINJ, INC.Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
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Publication number: 20150248604Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.Type: ApplicationFiled: May 16, 2015Publication date: September 3, 2015Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
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Publication number: 20150227832Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.Type: ApplicationFiled: August 23, 2013Publication date: August 13, 2015Applicant: Impinj, Inc.Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
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Patent number: 9053400Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.Type: GrantFiled: August 23, 2013Date of Patent: June 9, 2015Assignee: Impinj, Inc.Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
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Patent number: 8796865Abstract: Radio Frequency Identification (RFID) tags are provided, along with apparatuses and methods for making. In some embodiments, the RFID tags include an RFID tag chip that is attached to an inlay and/or a strap. The inlay or strap has one or more contact bumps formed thereon. In some of these embodiments, the RFID tag chip includes pads for electrical contacts, but not chip-bumps, thanks to the contact bump.Type: GrantFiled: November 18, 2013Date of Patent: August 5, 2014Assignee: Impinj, Inc.Inventors: Jay M. Fassett, Ronald A. Oliver, Ronald L. Koepp, Steven I. Mozsgai, Ernest Allen, III
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Publication number: 20140073071Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.Type: ApplicationFiled: August 23, 2013Publication date: March 13, 2014Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
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Publication number: 20140070010Abstract: Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. The first and second antenna contacts are electrically disconnected from each other.Type: ApplicationFiled: August 23, 2013Publication date: March 13, 2014Applicant: Impinj, Inc.Inventors: Christopher J. Diorio, Ronald L. Koepp, Harley K. Heinrich, Theron Stanford, Ronald A. Oliver, Shailendra Srinivas
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Patent number: 8661652Abstract: RFID tags are assembled through affixing an antenna to an integrated circuit (IC) by forming one or more capacitors coupling the antenna and the IC with the dielectric material of the capacitor(s) including a non-conductive covering layer of the IC, a non-conductive covering layer of the antenna such as an oxide layer, and/or an additionally formed dielectric layer. Top and bottom plates of the capacitor(s) are formed by the antenna traces and one or more patches on a top surface of the IC.Type: GrantFiled: April 26, 2012Date of Patent: March 4, 2014Assignee: Impinj, Inc.Inventors: Ronald L. Koepp, Ronald A. Oliver, William T. Colleran, Yanjun Ma, Jay M. Fassett, Vincent C. Moretti
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Patent number: 8614506Abstract: Radio Frequency Identification (RFID) tags are provided, along with apparatuses and methods for making. In some embodiments, the RFID tags include an RFID tag chip that is attached to an inlay and/or a strap. The inlay or strap has one or more contact bumps formed thereon. In some of these embodiments, the RFID tag chip includes pads for electrical contacts, but not chip-bumps, thanks to the contact bump.Type: GrantFiled: September 25, 2008Date of Patent: December 24, 2013Assignee: Impinj, Inc.Inventors: Jay M. Fassett, Ernest Allen, III, Ronald L. Koepp, Ronald A. Oliver, Steven I. Mozsgai
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Patent number: 8511569Abstract: A nonconductive, organic stabilization layer deposited on an RFID IC provides a consistent and predictable mounting distance between the RFID IC and its antenna layer or a strap, thereby ensuring a consistent and predictable mounting capacitance between circuits of the RFID IC and an antenna formed on the inlay or the strap. Openings in the stabilization layer enable electrical connection between the antenna pads of the RFID IC and the terminals of the inlay antenna or strap contacts through bumps formed on the antenna pads, through a conductive redistribution layer formed on the stabilization layer (when the inlay or strap is attached to the RFID IC by means of an anisotropic conductive layer), or through a capacitive connection to the inlay antenna or strap (when the inlay or strap is attached to the RFID IC by means of a nonconductive layer).Type: GrantFiled: March 22, 2011Date of Patent: August 20, 2013Assignee: Impinj, Inc.Inventors: Ronald L. Koepp, Harley K. Heinrich, Christopher J. Diorio
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Patent number: 8201748Abstract: A precursor for a Radio Frequency Identification (RFID) tag includes a conductive lead frame with at least three segments, an RFID Integrated Circuit (IC) with at least two antenna terminals, and at least two jumpers. The RFID IC is mounted on at least one of the segments. The antenna terminals are electrically coupled to at least two of the segments, and the jumpers electrically couple the segments such that the coupled segments form a two-turn coil between the antenna terminals of the RFID IC.Type: GrantFiled: April 26, 2010Date of Patent: June 19, 2012Assignee: Impinj, Inc.Inventors: Ronald L. Koepp, Ronald A. Oliver, Jay Fassett, Christopher J. Diorio