Patents by Inventor Ronald Lee Mendelson

Ronald Lee Mendelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wirebond passivation pad connection using heated capillary
    Patent number: 6605526
    Abstract: A method for forming a wirebond connection to an integrated circuit structure includes forming an insulative structure overlaying a corrosion susceptible metal wiring within the integrated circuit structure, defining a via through the insulative structure above a portion of the corrosion susceptible metal without exposing the portion of the corrosion susceptible metal, and attaching a wirebond material to the portion of the corrosion susceptible metal. The attaching process includes a preliminary process of exposing the portion of the corrosion susceptible metal. The attaching completely covers the portion of the corrosion susceptible metal.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: August 12, 2003
    Assignee: International Business Machines Corporation
    Inventors: Wayne John Howell, Ronald Lee Mendelson, William Thomas Motsiff, Jean-Guy Quintal, Sylvain Ouimet
  • Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information
    Patent number: 6171873
    Abstract: A method is described by which the mechanical strength of chips of semiconductor devices can be controlled by appropriate wafer finishing and sorted by knowledge of the finishing method and chip and wafer geometry. The control and sorting derive from a knowledge of the geometry of the striations remaining on the back of chips after the wafer-grinding finishing step.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: January 9, 2001
    Assignee: International Business Machines Corporation
    Inventors: Ronald Lee Mendelson, Robert Francis Cook, David Frederick Diefenderfer, Eric Gerhard Liniger, John M. Blondin, Donald W. Brouillette
  • Chip crack stop
    Patent number: 6022791
    Abstract: A serpentine pattern has been found to be effective at interrupting propagation of delamination cracks in thin film layers. The ring is provided on a semiconductor chip to suppress crack propagation from the chip edge. The ring is effective even though it is filled with metal, the serpentine pattern providing significantly increased area as compared with a standard linear crack stop that the energy for crack propagation is dissipated. In addition to serpentines, pattern features such as staggered filled ring patterns and connected rings will also be effective at reducing the propagation of delamination cracks from edge to active area by virtue of the increased area of interaction between the crack and the crack stop.
    Type: Grant
    Filed: October 15, 1997
    Date of Patent: February 8, 2000
    Assignee: International Business Machines Corporation
    Inventors: Robert Francis Cook, Eric Gerhard Liniger, Ronald Lee Mendelson, Richard Charles Whiteside
  • Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information
    Patent number: 5888838
    Abstract: A method is described by which the mechanical strength of chips of semiconductor devices can be controlled by appropriate wafer finishing and sorted by knowledge of the finishing method and chip and wafer geometry. The control and sorting derive from a knowledge of the geometry of the striations remaining on the back of chips after the wafer-grinding finishing step.
    Type: Grant
    Filed: June 4, 1998
    Date of Patent: March 30, 1999
    Assignee: International Business Machines Corporation
    Inventors: Ronald Lee Mendelson, Robert Francis Cook, David Frederick Diefenderfer, Eric Gerhard Liniger, John M. Blondin, Donald W. Brouillette