Abstract: A hydrophobic silicone coating composition includes a trialkoxysilane with trialkoxy functionality, a polyfluorinated trialkoxysilane, and an organometallic cure catalyst. A coating on a substrate is provided that includes a cured film produced by the cure of the coating composition. The coating has a contact angle of at least 93 degrees after 500 hours of exposure to UV-A exposure in ASTM D 4329 QUV using UVA 340 bulbs, cycle B exposure of alternate cycles of UV exposure and condensing humidity all at elevated temperature.

Abstract: A conductive substance for the promotion of adhesion of liquid and powder coatings to non-conductive substrates is provided that includes a solvent. A chlorinated polyolefin dispersed is dispersed in the solvent along with conductive nanoparticulate. A process of applying a conductive adhesion promoter to a non-conductive substrate is also provided that includes the application of this conductive adhesion promoter to a non-conductive substrate. The surface resistivity the substrate with a cured, dried film of the conductive adhesion promotor is less than 106 Ohm/Square. The conductive adhesion promotor cures and dries at an ambient temperature of 20° C. (1 atm) in 3-8 minutes. A dried film on a non-conductive substrate is also provided that has a cured matrix of chlorinated polyolefin in which conductive particulate is dispersed.

Abstract: A hydrophobic silicone coating composition includes a trialkoxysilane with trialkoxy functionality, a polyfluorinated trialkoxysilane, and an organometallic cure catalyst. A coating on a substrate is provided that includes a cured film produced by the cure of the coating composition. The coating has a contact angle of at least 93 degrees after 500 hours of exposure to UV-A exposure in ASTM D 4329 QUV using UVA 340 bulbs, cycle B exposure of alternate cycles of UV exposure and condensing humidity all at elevated temperature.