Patents by Inventor Ronald Lin

Ronald Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10898139
    Abstract: A spine of an electrode assembly is constructed by simultaneously deploying a plurality of individual bobbins of lead wire radially around the longitudinal axis of a polymeric tube. A free end of lead wire from each bobbin is electrically connected to a respective electrode and the electrodes are sequentially installed from a distal first location on the polymeric tube to a proximal location. Each lead wire may be helically wound around the polymeric tube between the electrode to which the lead wire is electrically connected and a proximally adjacent electrode, such that each lead wire between adjacent pairs of electrodes has an alternating direction of winding.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: January 26, 2021
    Assignee: Biosense Webster (Israel) Ltd.
    Inventors: Alexandru Guta, Marius Petrulis, Ronald Lin, Jon Davis, David Johnson, Patrick O'Fallon
  • Publication number: 20170347959
    Abstract: A spine of an electrode assembly is constructed by simultaneously deploying a plurality of individual bobbins of lead wire radially around the longitudinal axis of a polymeric tube. A free end of lead wire from each bobbin is electrically connected to a respective electrode and the electrodes are sequentially installed from a distal first location on the polymeric tube to a proximal location. Each lead wire may be helically wound around the polymeric tube between the electrode to which the lead wire is electrically connected and a proximally adjacent electrode, such that each lead wire between adjacent pairs of electrodes has an alternating direction of winding.
    Type: Application
    Filed: June 3, 2016
    Publication date: December 7, 2017
    Inventors: Alexandru Guta, Marius Petrulis, Ronald Lin, Jon Davis, David Johnson, Patrick O'Fallon
  • Patent number: 6218306
    Abstract: In the formation of metal vias, plugs or lines, a metal layer is deposited onto a non-planar non-metallic surface of a substrate. The metal layer is chemical mechanical polished with a first polishing pad until the metal layer is substantially planarized and a residual layer having a thickness about equal to the depth of potential microscratches, between about 200 and 1000 angstroms, remains over the non-metallic surface. The residual layer is chemical mechanical polished with a second, softer polishing pad until the non-metallic surface is exposed and the residual layer is removed.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: April 17, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Boris Fishkin, Kapila Wijekoon, Ronald Lin