Patents by Inventor Ronald Liu

Ronald Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11042529
    Abstract: Disclosed herein are system, method, and computer program product embodiments system of migration and validation. An embodiment operates by receiving an indication of a plurality of documents for migration from a legacy data format to a new data format of a computing system. A first set of data statistics corresponding to a selected one of the subset of documents prior to a performance of the migration, and a second set of data statistics corresponding to the selected document after the performance of the migration are determined. Both the first set of data statistics and the second set of data statistics side-by-side for the selected document are displayed. An indication whether the migration is validated or invalidated is received.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: June 22, 2021
    Assignee: salesforce.com, inc.
    Inventors: Minh Nguyen, Kevin Wang, Devra Struzenberg, Zhongyu Ma, Xin Li, Ronald Liu, Carla Ferreira, Amber Murray, Le Gao
  • Patent number: 10970268
    Abstract: Disclosed herein are system, method, and computer program product embodiments system of migration and validation. An embodiment operates by receiving an indication of a plurality of documents for migration from a legacy data format to a new data format of a computing system. A first set of data statistics corresponding to a selected one of the subset of documents prior to a performance of the migration, and a second set of data statistics corresponding to the selected document after the performance of the migration are determined. Both the first set of data statistics and the second set of data statistics side-by-side for the selected document are displayed. An indication whether the migration is validated or invalidated is received.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: April 6, 2021
    Assignee: salesforce.com, inc.
    Inventors: Minh Nguyen, Kevin Wang, Devra Struzenberg, Zhongyu Ma, Xin Li, Ronald Liu, Carla Ferreira, Amber Murray, Le Gao
  • Publication number: 20190138626
    Abstract: Disclosed herein are system, method, and computer program product embodiments system of migration and validation. An embodiment operates by receiving an indication of a plurality of documents for migration from a legacy data format to a new data format of a computing system. A first set of data statistics corresponding to a selected one of the subset of documents prior to a performance of the migration, and a second set of data statistics corresponding to the selected document after the performance of the migration are determined. Both the first set of data statistics and the second set of data statistics side-by-side for the selected document are displayed. An indication whether the migration is validated or invalidated is received.
    Type: Application
    Filed: November 3, 2017
    Publication date: May 9, 2019
    Inventors: Minh Nguyen, Kevin WANG, Devra STRUZENBERG, Zhongyu MA, Xin LI, Ronald LIU, Carla FERREIRA, Amber MURRAY, Le GAO
  • Publication number: 20160283947
    Abstract: Disclosed are examples of systems, apparatus, methods and computer program products for sharing knowledge article content. In some implementations, a customer relationship management (CRM) record having a dedicated feed in a social networking system can be processed. A selection of a knowledge article can be received via a user interface. A communication channel can be identified. Selected knowledge article content of selected layout attributes corresponding to the identified communication channel can be inserted into a message. The message can be sent to a recipient device via the identified communication channel.
    Type: Application
    Filed: March 26, 2015
    Publication date: September 29, 2016
    Inventors: Eric Shu Wang Yip, Jianming Shao, Ronald Liu, Spencer Scorcelletti, Srinath Viswanathan, Zhongyu Ma
  • Patent number: 6658725
    Abstract: A method and an apparatus for forming a crimped joint in an electrical wire terminal. The apparatus forms a crimped joint and substantially simultaneously bends and/or twists the terminal and electrical wire about their respective longitudinal axes, effective to reduce electrical contact resistance within the formed joint.
    Type: Grant
    Filed: May 10, 2000
    Date of Patent: December 9, 2003
    Assignee: Ford Global Technologies, LLC
    Inventor: Dangrong Ronald Liu
  • Patent number: 6095400
    Abstract: There is disclosed herein a solder preform for use on printed circuit boards to provide reinforced solder joints thereon. The preform 70 comprises a solder body 72 made of solder, and a thin metallic member 30 attached to the solder body 72. The member 30 may be a metallic screen or foil having holes or perforations 32 therethrough, or may be a non-perforated metallic foil. A method for producing such reinforced solder joints is also disclosed.
    Type: Grant
    Filed: December 4, 1997
    Date of Patent: August 1, 2000
    Assignee: Ford Global Technologies, Inc.
    Inventor: Dangrong Ronald Liu
  • Patent number: 6087596
    Abstract: A printed circuit board 50 with reinforced solder joints and having a substrate 11 having mounting pads 14 arranged thereon and a surface mount component 13 having terminations 12, wherein the component 13 is disposed on the substrate 11 with each termination 12 being registered atop a respective mounting pad 14. A solder joint 10 connects each termination 12 with its respective mounting pad 14, and a thin metallic member 30 is disposed within each solder joint 10 between each termination 12 and its respective mounting pad 14. Metallic member 30 is space from both the mounting pad ant the termination and is the same size as the mounting pad or smaller.
    Type: Grant
    Filed: December 4, 1997
    Date of Patent: July 11, 2000
    Assignee: Ford Motor Company
    Inventor: Dangrong Ronald Liu
  • Patent number: 5813884
    Abstract: There is disclosed herein a leadless electronic component (LEC) which avoids solder joint crack initiation. A preferred embodiment of the LEC 110 comprises a body portion 112 having terminations 114 arranged thereabout, each termination having a bottom portion 124 with an interior edge 126, wherein the interior edge has a substantially meniscus-like shape oriented so as to be concave with respect to a centroid of the LEC.
    Type: Grant
    Filed: April 7, 1997
    Date of Patent: September 29, 1998
    Assignee: Ford Global Technologies, Inc.
    Inventors: Yi-Hsin Pao, Dangrong Ronald Liu, Chan-Jiun Ed Jih, Xu Song