Abstract: A test system for testing an integrated circuit package is provided. The test system may include a test board on which a package under test can be mounted, a test box for gathering desired measurements on the package under test, and a test host for automatically controlling the test box during testing. The test box may be coupled to row multiplexing circuitry and column multiplexing circuitry for selectively addressing one or more daisy-chained nets in the package under test. The test box may also be coupled to a source measurement unit (SMU) component that provides current source signals to the package under test and to a digital multimeter (DMM) component that provides voltage sense signals to the package under test. Arranged in this way, the test system can be configured to perform automated I-V curve tracing, resistance measurements, open/short circuit detection, and monitoring of other package-level manufacturing defects.

Abstract: A touch-down counter is provided that maintains a count of how many times integrated circuits are placed into contact with a contactor in a test handler. The test handler has a work press that places integrated circuits into contact with pogo pins in the contactor. The pins are subject to wear and should be maintained by periodic cleaning. The touch-down counter has a sensor such as a non-contact Hall effect sensor that is attached to the contactor. A magnet is affixed to the side of the work press. When the work press comes into the vicinity of the sensor, the sensor detects the presence of the magnet and registers a contactor touch-down event. A lifetime count of touch-down events may be displayed on the counter. When a recommended threshold value of touch-down events has been exceeded, a test system operator can remove the contactor from use for cleaning.