Abstract: Devices and methods for testing microelectronic assemblies including wireless communications are disclosed herein. For example, in some embodiments, a wireless testing system may include a radio frequency (RF) shielded chamber; a device under test (DUT) in the RF shielded chamber, wherein the DUT includes an array of first antenna elements; a testing apparatus in the RF shielded chamber including an array of second antenna elements at a first surface of a substrate to receive a test signal from the DUT, wherein a distance between individual second antenna elements and an adjacent second antenna element is at least half of a wavelength of the test signal, and wherein a distance between the first antenna elements and the second antenna elements is within a near-field region; and an array of electrical switches, wherein an individual electrical switch is coupled to a respective individual second antenna element.

Abstract: Devices and methods for testing microelectronic assemblies including wireless communications are disclosed herein. For example, in some embodiments, a wireless testing system may include a radio frequency (RF) shielded chamber; a device under test (DUT) in the RF shielded chamber, wherein the DUT includes an array of first antenna elements; a testing apparatus in the RF shielded chamber including an array of second antenna elements at a first surface of a substrate to receive a test signal from the DUT, wherein a distance between individual second antenna elements and an adjacent second antenna element is at least half of a wavelength of the test signal, and wherein a distance between the first antenna elements and the second antenna elements is within a near-field region; and an array of electrical switches, wherein an individual electrical switch is coupled to a respective individual second antenna element.

Abstract: Assemblies, methods, and systems for controlling the temperature of an electronic device are described. One method includes positioning an electronic device in a chamber and electrically coupling a probe to the electronic device. The method also includes flowing a fluid in contact with the electronic device at a flow rate, the fluid comprising a liquid. A current is applied to the probe to carry out an electronic device testing operation, and a temperature of the electronic device is monitored during the electronic testing operation. The method may also include determining whether a change to the flow rate or temperature is necessary based on the monitored temperature of the electronic device. In one aspect of certain embodiments, the electronic device may be positioned so that each of the sides of the electronic device may be at least partially in contact with the fluid during the electronic device testing operation.