Abstract: Amorphous silicon devices, systems, and related methods are described herein. An example method for fabricating a thin film with light-emitting or light-detecting capability can include depositing a thin film of amorphous silicon on a wafer such that crystalline defects are distributed throughout the thin film. Additionally, an example photonic device can include a p-doped region and an n-doped region formed on a wafer, and a resonator structure formed on the wafer. The resonator structure can be formed from amorphous silicon and can be arranged between the p-doped and n-doped regions to form a PIN junction. Optionally, the photonic device can be incorporated into a monolithic integrated optical system.

Abstract: An example method of forming a deterministic thin film from a crystal substrate is described herein. The method can include implanting ions into a surface of the crystal substrate to form a thin film crystal layer, and bonding the crystal substrate and a handle substrate to form a bilayer bonding interface between the crystal substrate and the handle substrate. The method can also include exfoliating the thin film crystal layer from the crystal substrate, patterning the thin film crystal layer to define a deterministic thin film, etching one or more trenches in the thin film crystal layer, etching the bilayer bonding interface via the one or more trenches, and releasing the deterministic thin film from the handle substrate.

Abstract: An example optical polarization controller can include a substantially planar substrate and a waveguide unit cell formed on the substantially planar substrate. The waveguide unit cell can include a first out-of-plane waveguide portion and a second out-of-plane waveguide portion coupled to the first out-of-plane waveguide portion. Each of the first and second out-of-plane waveguide portions can respectively include a core material layer arranged between a first optical cladding layer having a first stress-response property and a second optical cladding layer having a second stress-response property. The first and second stress-response properties can be different such that each of the first and second out-of-plane waveguide portions is deflected by a deflection angle.

Abstract: Amorphous silicon devices, systems, and related methods are described herein. An example method for fabricating a thin film with light-emitting or light-detecting capability can include depositing a thin film of amorphous silicon on a wafer such that crystalline defects are distributed throughout the thin film. Additionally, an example photonic device can include a p-doped region and an n-doped region formed on a wafer, and a resonator structure formed on the wafer. The resonator structure can be formed from amorphous silicon and can be arranged between the p-doped and n-doped regions to form a PIN junction. Optionally, the photonic device can be incorporated into a monolithic integrated optical system.

Abstract: An example optical polarization controller can include a substantially planar substrate and a waveguide unit cell formed on the substantially planar substrate. The waveguide unit cell can include a first out-of-plane waveguide portion and a second out-of-plane waveguide portion coupled to the first out-of-plane waveguide portion. Each of the first and second out-of-plane waveguide portions can respectively include a core material layer arranged between a first optical cladding layer having a first stress-response property and a second optical cladding layer having a second stress-response property. The first and second stress-response properties can be different such that each of the first and second out-of-plane waveguide portions is deflected by a deflection angle.

Abstract: An example method of forming a deterministic thin film from a crystal substrate is described herein. The method can include implanting ions into a surface of the crystal substrate to form a thin film crystal layer, and bonding the crystal substrate and a handle substrate to form a bilayer bonding interface between the crystal substrate and the handle substrate. The method can also include exfoliating the thin film crystal layer from the crystal substrate, patterning the thin film crystal layer to define a deterministic thin film, etching one or more trenches in the thin film crystal layer, etching the bilayer bonding interface via the one or more trenches, and releasing the deterministic thin film from the handle substrate.

Abstract: An example optical polarization controller can include a substantially planar substrate and a waveguide unit cell formed on the substantially planar substrate. The waveguide unit cell can include a first out-of-plane waveguide portion and a second out-of-plane waveguide portion coupled to the first out-of-plane waveguide portion. Each of the first and second out-of-plane waveguide portions can respectively include a core material layer arranged between a first optical cladding layer having a first stress-response property and a second optical cladding layer having a second stress-response property. The first and second stress-response properties can be different such that each of the first and second out-of-plane waveguide portions is deflected by a deflection angle.

Abstract: An example optical polarization controller can include a substantially planar substrate and a waveguide unit cell formed on the substantially planar substrate. The waveguide unit cell can include a first out-of-plane waveguide portion and a second out-of-plane waveguide portion coupled to the first out-of-plane waveguide portion. Each of the first and second out-of-plane waveguide portions can respectively include a core material layer arranged between a first optical cladding layer having a first stress-response property and a second optical cladding layer having a second stress-response property. The first and second stress-response properties can be different such that each of the first and second out-of-plane waveguide portions is deflected by a deflection angle.

Abstract: Development of Integrated Optical Circuits depends greatly on progress in coupling light to and between chip devices. Exemplary disclosed embodiments provide a system and method of fabricating couplers for optical chips that may allow for access to devices on the entire chip surface. Cantilever couplers comprising optical waveguides are deflected out-of-plane creating access to remote portions of devices. An exemplary system and method may provide waveguides with tunable angles of deflection creating greater flexibility in optical coupling options.

Abstract: An apparatus and method to simultaneously measure electric and thermal fields with a single probe. Using an electrooptic semiconductor probe, the Pockels effect is employed to measure electric field magnitude and phase, and the effect of photon absorption due to bandtail states in the semiconductor is used to measure temperature. Techniques to scale relative electric-field measurements to absolute units (volts/meter), stabilize electric-field phase drift, and calibrate electric-field data that is corrupted when the probe is used in regions where temperature gradients exist are provided.