Abstract: A method for phase-voltage based motor period measurement includes generating a commanded phase voltage and applying the commanded phase voltage to a first phase voltage input of an electric motor, a second phase voltage input of the electric motor, and a third phase voltage input of the electric motor, measuring a first period of a phase voltage associated with the first phase voltage input and the second phase voltage input and comparing the measured first period to a frequency of the commanded phase voltage, and, in response to a determination that the measured first period of the phase voltage associated with the first phase voltage input and the second phase voltage input is outside of a range of the frequency associated with the commanded phase voltage, identifying a fault associated with the first integrated circuit or signal path.

Abstract: A method for phase-voltage based motor period measurement includes generating a commanded phase voltage and applying the commanded phase voltage to a first phase voltage input of an electric motor, a second phase voltage input of the electric motor, and a third phase voltage input of the electric motor, measuring a first period of a phase voltage associated with the first phase voltage input and the second phase voltage input and comparing the measured first period to a frequency of the commanded phase voltage, and, in response to a determination that the measured first period of the phase voltage associated with the first phase voltage input and the second phase voltage input is outside of a range of the frequency associated with the commanded phase voltage, identifying a fault associated with the first integrated circuit or signal path.

Abstract: A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.

Abstract: A power electronic module includes heat generating power electronic devices mounted on a circuit board within a connector outline circumscribing circuit board through-holes for receiving pin terminals of a connector assembly. The power electronic devices are thermally and electrically coupled to the circuit board through-holes and connector pin terminals to dissipate heat generated by the power electronic devices.

Abstract: A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.