Patents by Inventor Ronald Martinus Alexander HEEREN

Ronald Martinus Alexander HEEREN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240003899
    Abstract: The present invention relates to a method for the detection of analytes in a tissue sample, wherein a combination of mass spectrometry imaging (MSI) analysis and laser capture microdissection (LCM) is carried out on a tissue sample on a conductive glass slide, using the same section for MSI and LCM. The method can be used for the detection of proteins, lipids, metabolites and glycans.
    Type: Application
    Filed: October 13, 2021
    Publication date: January 4, 2024
    Inventors: Berta CILLERO PASTOR, Ronald Martinus Alexander HEEREN, Stephanie Theresia Petronella MEZGER
  • Patent number: 10056239
    Abstract: An ultra-high vacuum (UHV) compatible feedthrough structure and a detector assembly using such feedthrough structure, the feedthrough structure comprising a printed circuit board (PCB) for carrying one or more detectors, wherein said PCB comprises a top surface covered with a first UHV sealing layer and one or more first electrical electrodes and at least a first thermally conductive layer extending at least partly over said top surface; and, a back surface comprising one or more second electrodes and at least a second thermally conductive layer extending at least partly over said back surface, wherein one or more conductive wires are embedded in said PCB for electrically connecting said one or more first electrodes with said one or more second electrodes respectively; and, wherein one or more thermally conductive vias are embedded in said PCB for thermally connecting said at least first thermally conductive layer with said second thermally conductive layer.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: August 21, 2018
    Assignee: PARTICLE PHYSICS INSIDE PRODUCTS B.V.
    Inventors: Dirk-Jan Spaanderdam, Julia Helga Jungmann, Ronald Martinus Alexander Heeren
  • Patent number: 9786483
    Abstract: An ion trap such as an ion cyclotron resonance analyzer cell (trap) is described wherein the ion trap comprises a plurality of electrodes and has at least one integrated ion detector, preferably a position-sensitive and/or time-sensitive ion detector, wherein at least part of said ion detector is configured as an electrode of said ion trap. Methods of position-sensitive detection of ions in such ion trap are described as well.
    Type: Grant
    Filed: April 24, 2014
    Date of Patent: October 10, 2017
    Assignee: AMSTERDAM SCIENTIFIC INSTRUMENTS HOLDING B.V.
    Inventors: Ronald Martinus Alexander Heeren, Julia Helga Jungmann, Don Smith
  • Publication number: 20160086787
    Abstract: An ion trap such as an ion cyclotron resonance analyzer cell (trap) is described wherein the ion trap comprises a plurality of electrodes and has at least one integrated ion detector, preferably a position-sensitive and/or time-sensitive ion detector, wherein at least part of said ion detector is configured as an electrode of said ion trap. Methods of position-sensitive detection of ions in such ion trap are described as well.
    Type: Application
    Filed: April 24, 2014
    Publication date: March 24, 2016
    Inventors: Ronald Martinus Alexander Heeren, Julia Helga Jungmann, Don Smith
  • Publication number: 20150348766
    Abstract: An ultra-high vacuum (UHV) compatible feedthrough structure and a detector assembly using such feedthrough structure, the feedthrough structure comprising a printed circuit board (PCB) for carrying one or more detectors, wherein said PCB comprises a top surface covered with a first UHV sealing layer and one or more first electrical electrodes and at least a first thermally conductive layer extending at least partly over said top surface; and, a back surface comprising one or more second electrodes and at least a second thermally conductive layer extending at least partly over said back surface, wherein one or more conductive wires are embedded in said PCB for electrically connecting said one or more first electrodes with said one or more second electrodes respectively; and, wherein one or more thermally conductive vias are embedded in said PCB for thermally connecting said at least first thermally conductive layer with said second thermally conductive layer.
    Type: Application
    Filed: November 19, 2013
    Publication date: December 3, 2015
    Inventors: Dirk-Jan SPAANDERDAM, Helga Julia JUNGMANN, Ronald Martinus Alexander HEEREN