Patents by Inventor Ronald McBean

Ronald McBean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS package and method of forming the same
    Publication number: 20070045795
    Abstract: A MEMS package (100, 300) and method of fabrication include a package (100, 300) that is formed by bonding a first component (102, 302), which includes a MEMS device (106, 306) and a substrate (104, 304) upon which the MEMS device (106, 306) was formed as a part thereof, to a second component (202, 402) during wafer level packaging. The first component (102, 302) is bonded to the second component (202, 402) using bump bonding or coined wire bonding. The MEMS device (106, 306) resides in a sealed cavity (250, 350) defined by a collar structure (252, 352) formed by the two components (101, 202, 302, 402). The collar structure (252, 352) provides a sealed airspace in which the MEMS device (106, 306) resides and operates.
    Type: Application
    Filed: August 31, 2005
    Publication date: March 1, 2007
    Inventor: Ronald McBean