Patents by Inventor Ronald Michels

Ronald Michels has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low cost metallization during fabrication of an integrated circuit (IC)
    Patent number: 10461025
    Abstract: A method for metallization during fabrication of an Integrated Circuit (IC). The IC includes a semiconductor wafer having a back surface and a front surface. The method includes etching a via hole through the semiconductor wafer. After this, a seed metal layer is deposited on the back surface of the semiconductor wafer. Thereafter, a photoresist layer is deposited on the back surface of the semiconductor wafer such that the via hole remains uncovered. After depositing the photoresist layer, a metal layer is formed along the walls of the via hole to electrically connect the back surface and the front surface of the semiconductor wafer. Finally, the photoresist layer is removed subsequent to forming the metal layer.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: October 29, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Mohsen Shokrani, Boris Gedzberg, Ronald Michels