Patents by Inventor Ronald N. Graver

Ronald N. Graver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plastic package with lead frame crossunder
    Patent number: 4595945
    Abstract: Proposed is a new way to distribute power off chip using a specially designed lead frame. The support paddle of the lead frame is split electrically and provides at least two conductor members that are arranged to cross under the chip after the chip is bonded to the paddle. Power and/or ground can be distributed to two or more edges of the chip by providing bonding sites at or near the extremities of the crossunders. The chip itself is electrically isolated from the crossunder members.
    Type: Grant
    Filed: October 21, 1983
    Date of Patent: June 17, 1986
    Assignee: AT&T Bell Laboratories
    Inventor: Ronald N. Graver
  • Integrated circuit packages
    Patent number: H73
    Abstract: A package for wire-bonded semiconductor integrated circuit chips is disclosed. The chip is covered by a protective layer of material such as room temperature vulcanizing silicone rubber. The thickness of the layer is such that it covers a portion of the arched wires, thereby concentrating the stresses away from the wire-ball bond interfaces. The chip is encapsulated in a plastic material while providing an air gap between the plastic and protective layer.
    Type: Grant
    Filed: August 25, 1983
    Date of Patent: June 3, 1986
    Assignee: AT&T Bell Laboratories
    Inventors: Kenneth K. Claasen, Ronald N. Graver, Frank P. Pelletier, Kurt M. Striny, Ronald J. Wozniak