Patents by Inventor Ronald Nasman
Ronald Nasman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11920782Abstract: Vaporizer cores are disclosed including a housing and a chamber where the chamber includes a porous lattice structure that is thermally conductive. Further, the housing and the chamber including the porous lattice structure are formed as a single integral structure. Three-dimensional (3D) printing can be used to form the housing and the chamber including the porous lattice structure as a single integral structure. For certain embodiments, a concentric-circle fin design, a crisscross fin design, or a conical fin design is used to form the porous lattice structure for the vaporizer chamber. For further embodiments, techniques are implemented to resolve potential problems with 3D printing of the vaporizer cores. One example technique is encapsulation of the vaporizer core within a shell, such as a two-piece shell, to resolve potential problems with leaks. Disclosed embodiments for the vaporizer cores provide manufacturing, material, and design improvements to prior solutions.Type: GrantFiled: November 5, 2020Date of Patent: March 5, 2024Assignee: Tokyo Electron LimitedInventors: Ronald Nasman, Daniel Newman
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Patent number: 11908728Abstract: Techniques herein include a process chamber for depositing thin films to backside surfaces of wafers to reduce wafer bowing and distortion. A substrate support provides an annular perimeter seal around the bottom and/or side of the wafer which allows the majority of the substrate backside to be exposed to a process environment. A supported wafer separates the chamber into lower and upper chambers that provide different process environments. The lower section of the processing chamber includes deposition hardware configured to apply and remove thin films. The upper section can remain a chemically inert environment, protecting the existing features on the top surface of the wafer. Multiple exhausts and differential pressures are used to prevent deposition gasses from accessing the working surface of a wafer.Type: GrantFiled: July 27, 2018Date of Patent: February 20, 2024Assignee: Tokyo Electron LimitedInventors: Ronald Nasman, Gerrit J. Leusink, Rodney L. Robison, Hoyoung Kang, Daniel Fulford
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Publication number: 20230405642Abstract: Improved processing systems and methods are provided for wet and dry processing of a semiconductor wafer. Provided is an enclosed chamber for processing a semiconductor wafer within a processing space and a drainage system for directing processing fluids out of the processing space. The enclosed chamber includes a top plate and a bottom plate, which physically confine the processing fluids within a relatively small, enclosed processing space. This forces the processing fluids to flow radially across the wafer surface(s) without the need to rotate the wafer. The drainage system contains a conduit that is downstream from the processing space and configured to retain a portion of a processing fluid dispensed within the processing space. The portion retained within the conduit provides a pressure resistance against the processing fluid(s) dispensed within the processing space to improve wet and dry processing of the wafer surfaces.Type: ApplicationFiled: March 29, 2023Publication date: December 21, 2023Inventors: Shan Hu, Peter D'Elia, Ronald Nasman
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Patent number: 11360388Abstract: Techniques herein include processes and systems by which a reproducible CD variation pattern can be mitigated or corrected to yield desirable CDs from microfabrication patterning processes, via resolution enhancement. A repeatable portion of CD variation across a set of wafers is identified, and then a correction exposure pattern is generated. A direct-write projection system exposes this correction pattern on a substrate as a component exposure, augmentation exposure, or partial exposure. A conventional mask-based photolithographic system executes a primary patterning exposure as a second or main component exposure. The two component exposures when combined enhance resolution of the patterning exposure to improve CDs on the substrate being processed without measure each wafer.Type: GrantFiled: March 19, 2019Date of Patent: June 14, 2022Assignee: Tokyo Electron LimitedInventors: Anton deVilliers, Ronald Nasman, Jeffrey Smith
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Publication number: 20210148564Abstract: Vaporizer cores are disclosed including a housing and a chamber where the chamber includes a porous lattice structure that is thermally conductive. Further, the housing and the chamber including the porous lattice structure are formed as a single integral structure. Three-dimensional (3D) printing can be used to form the housing and the chamber including the porous lattice structure as a single integral structure. For certain embodiments, a concentric-circle fin design, a crisscross fin design, or a conical fin design is used to form the porous lattice structure for the vaporizer chamber. For further embodiments, techniques are implemented to resolve potential problems with 3D printing of the vaporizer cores. One example technique is encapsulation of the vaporizer core within a shell, such as a two-piece shell, to resolve potential problems with leaks. Disclosed embodiments for the vaporizer cores provide manufacturing, material, and design improvements to prior solutions.Type: ApplicationFiled: November 5, 2020Publication date: May 20, 2021Inventors: Ronald Nasman, Daniel Newman
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Patent number: 10807117Abstract: Provided is a method of limiting exposure of a dispense chemical to air and meet dispense objectives in a dispense nozzle system, the method comprising: providing a sample requiring a dispense process of a dispense chemical using a dispense nozzle system; performing an opening cycle of dispense process steps to get the dispense nozzle system ready; dispensing a dispense chemical onto the sample; and performing a closing cycle of dispense process steps to prepare the nozzle system for non-use; repeating the operations of performing the opening cycle of dispense process steps, dispensing the chemical, and performing the closing cycle of dispense process steps a prescribed number of times depending on an application.Type: GrantFiled: October 3, 2016Date of Patent: October 20, 2020Assignee: Tokyo Electron LimitedInventors: Ronald Nasman, Bruce Altemus
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Patent number: 10712663Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A modular hydraulic unit houses the elongate bladder and hydraulic fluid in contact with an exterior surface of the bladder. When pressurized process fluid is in the elongate bladder, hydraulic controls can selectively reduce pressure on the bladder to cause expansion, and then selectively increase hydraulic pressure to assist with a dispense action.Type: GrantFiled: August 11, 2017Date of Patent: July 14, 2020Assignee: Tokyo Electron LimitedInventors: Anton J. deVilliers, Ronald Nasman, David Travis, James Grootegoed, Norman A. Jacobson, Jr.
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Patent number: 10685857Abstract: Provided is a nozzle system for dispensing a dispense chemical onto a substrate, the system comprising: a nozzle comprising a nozzle body and a nozzle tip; a shielding device coupled to the nozzle tip, the shielding device configured to create a mini-environment for a dispense chemical such that a partial pressure of the dispense chemical is maintained in the shielding device; wherein the nozzle system is configured to meet selected dispense objectives.Type: GrantFiled: May 7, 2018Date of Patent: June 16, 2020Assignee: Tokyo Electron LimitedInventors: Ronald Nasman, Lior Huli
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Patent number: 10426001Abstract: A processing system is disclosed, having a process chamber that houses a substrate for exposure of a surface of the substrate to a travelling electromagnetic (EM) wave. The processing system also includes an EM wave transmission antenna configured to launch the travelling EM wave into the process chamber for the travelling EM wave to propagate in a direction substantially parallel to the surface of the substrate. The processing system also includes a power coupling system configured to supply EM energy into the EM wave transmission antenna to generate the travelling EM wave at a prescribed output power and in a prescribed EM wave mode during treatment of the substrate. The processing system also includes an EM wave receiving antenna configured to absorb the travelling EM wave after propagation through the process chamber.Type: GrantFiled: March 3, 2014Date of Patent: September 24, 2019Assignee: Tokyo Electron LimitedInventors: Ronald Nasman, Mirko Vukovic, Gerrit J. Leusink, Rodney L. Robison, Robert D. Clark
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Publication number: 20190287795Abstract: Techniques herein include processes and systems by which a reproducible CD variation pattern can be mitigated or corrected to yield desirable CDs from microfabrication patterning processes, via resolution enhancement. A repeatable portion of CD variation across a set of wafers is identified, and then a correction exposure pattern is generated. A direct-write projection system exposes this correction pattern on a substrate as a component exposure, augmentation exposure, or partial exposure. A conventional mask-based photolithographic system executes a primary patterning exposure as a second or main component exposure. The two component exposures when combined enhance resolution of the patterning exposure to improve CDs on the substrate being processed without measure each wafer.Type: ApplicationFiled: March 19, 2019Publication date: September 19, 2019Inventors: Anton deVilliers, Ronald Nasman, Jeffrey Smith
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Patent number: 10403501Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A process fluid filter is located downstream from a process fluid source as well as a system valve. Downstream from the process fluid filter there are no valves. Dispense actions can be initiated and stop while the system valve is open by using the elongate bladder. The elongate bladder can be expanded to stop or pause a dispense action, and then be contracted to assist with a dispense action.Type: GrantFiled: August 11, 2017Date of Patent: September 3, 2019Assignee: Tokyo Electron LimitedInventors: Anton J. deVilliers, Rodney L. Robison, Ronald Nasman, David Travis, James Grootegoed, Norman A. Jacobson, Jr., Lior Huli, Joshua S. Hooge
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Patent number: 10354872Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A meniscus sensor monitors a position of a meniscus of process fluid at a nozzle. The elongate bladder unit is used to maintain a position of the meniscus at a particular location by selectively expanding or contracting the bladder, thereby moving or holding a meniscus position. Expansion of the elongate bladder is also used for a suck-back action after completing a dispense action.Type: GrantFiled: August 11, 2017Date of Patent: July 16, 2019Assignee: Tokyo Electron LimitedInventors: Anton J. deVilliers, Rodney L. Robison, Ronald Nasman, David Travis, James Grootegoed, Norman A. Jacobson, Jr., David Hetzer, Lior Huli, Joshua S. Hooge
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Patent number: 10256121Abstract: Embodiments include a method for controlled cooling of a heated stage. The method includes setting a stage coupling to a maximum value and heating the stage to a process temperature. The method includes providing a wafer on the heated stage in a process chamber. The method includes performing a process on the wafer and reducing the heating stage coupling to a predetermined minimum value and reducing the heated stage temperature. The method includes removing the wafer from the heated stage and the process chamber. The heated stage is covered with a plurality of pixels, each pixel of the plurality of pixels include a level of emissivity and are equipped with an emissivity control device configured to independently adjust the level of emissivity of the pixel. The heated stage coupling is configured to achieve a predetermined radiative coupling and control the wafer cooling rate and target temperature.Type: GrantFiled: July 6, 2015Date of Patent: April 9, 2019Assignee: Tokyo Electron LimitedInventors: Mirko Vukovic, Ronald Nasman
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Publication number: 20190035646Abstract: Techniques herein include a process chamber for depositing thin films to backside surfaces of wafers to reduce wafer bowing and distortion. A substrate support provides an annular perimeter seal around the bottom and/or side of the wafer which allows the majority of the substrate backside to be exposed to a process environment. A supported wafer separates the chamber into lower and upper chambers that provide different process environments. The lower section of the processing chamber includes deposition hardware configured to apply and remove thin films. The upper section can remain a chemically inert environment, protecting the existing features on the top surface of the wafer. Multiple exhausts and differential pressures are used to prevent deposition gasses from accessing the working surface of a wafer.Type: ApplicationFiled: July 27, 2018Publication date: January 31, 2019Inventors: Ronald Nasman, Gerrit J. Leusink, Rodney L. Robison, Hoyoung Kang, Daniel Fulford
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Publication number: 20180254202Abstract: Provided is a nozzle system for dispensing a dispense chemical onto a substrate, the system comprising: a nozzle comprising a nozzle body and a nozzle tip; a shielding device coupled to the nozzle tip, the shielding device configured to create a mini-environment for a dispense chemical such that a partial pressure of the dispense chemical is maintained in the shielding device; wherein the nozzle system is configured to meet selected dispense objectives.Type: ApplicationFiled: May 7, 2018Publication date: September 6, 2018Inventors: Ronald Nasman, Lior Huli
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Patent number: 10035113Abstract: Included is a method and system of generating a diffused fluid using a spiral mixer comprising: injecting a first fluid into a first inlet port, generating a first fluid ribbon using a first narrow-gap slot; injecting a second fluid into a second inlet port and generating a second fluid ribbon; combining the first fluid and the second fluid ribbon into a spiraling flow around a cone feature in the mixing chamber of the first spiral mixing block, generating a combined flow of diffused fluids; dividing the combined flow in the mixing chamber of the first flow divider block, generating a divided flow of diffused fluids; combining the divided flow a mixing chamber of the final spiral mixing block, generating a final combined fluid flow in a spiraling flow around a final cone feature; and flowing the final combined fluid flow and dispensing the combined fluid flow onto a substrate.Type: GrantFiled: June 12, 2015Date of Patent: July 31, 2018Assignee: Tokyo Electron LimitedInventors: Ronald Nasman, Anton J. deVilliers
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Patent number: 9987655Abstract: A fluid dispensing apparatus and method is disclosed. Systems include an in-line or linear bladder apparatus array configured to expand to collect a charge of fluid, and contract to assist with fluid delivery and dispensing. The bladder array is disposed within a chamber of pressure control fluid common to exterior surfaces of each bladder in the bladder array. Simultaneously, some bladders within the array of linear bladders can be dispensing fluid or maintaining fluid while some bladders are collecting fluid. A given filtration rate can be less than a dispense rate and thus the system herein compensates for filter-lag that often accompanies fluid filtering for microfabrication, while providing a generally linear configuration that reduces chances for defect creation. With multiple bladders, multiple different types of fluid can be readied for selective dispense.Type: GrantFiled: June 21, 2016Date of Patent: June 5, 2018Assignee: Tokyo Electron LimitedInventors: Anton J. deVilliers, Ronald Nasman, James Grootegoed, Norman A. Jacobson, Jr.
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Publication number: 20180066363Abstract: A vortical atomizing nozzle assembly, vaporizer, and related methods are disclosed for substrate processing systems. The vaporizer introduces an atomized or vaporized liquid into a substrate processing system and includes a vaporizer chamber, a nozzle assembly coupled to the inlet for the vaporizer chamber, and a carrier gas channel coupled to the nozzle assembly. The nozzle assembly includes a premix chamber, an outlet channel, and an expanding nozzle. The premix chamber includes a liquid inlet to receive the liquid to be vaporized and a gas inlet to receive the carrier gas. The carrier gas channel is positioned with respect to the gas inlet to cause a vortical flow within the premix chamber upon introduction of the carrier gas through the carrier gas channel. The premixed liquid from the premix chamber is received by the outlet channel and exits the outlet channel into the expanding nozzle.Type: ApplicationFiled: May 22, 2017Publication date: March 8, 2018Inventors: Ronald Nasman, Danny Newman, Rodney L. Robison
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Publication number: 20180047562Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A process fluid filter is located downstream from a process fluid source as well as a system valve. Downstream from the process fluid filter there are no valves. Dispense actions can be initiated and stop while the system valve is open by using the elongate bladder. The elongate bladder can be expanded to stop or pause a dispense action, and then be contracted to assist with a dispense action.Type: ApplicationFiled: August 11, 2017Publication date: February 15, 2018Inventors: Anton J. deVilliers, Rodney L. Robison, Ronald Nasman, David Travis, James Grootegoed, Norman A. Jacobson, JR., Lior Huli, Joshua S. Hooge
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Publication number: 20180046082Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A modular hydraulic unit houses the elongate bladder and hydraulic fluid in contact with an exterior surface of the bladder. When pressurized process fluid is in the elongate bladder, hydraulic controls can selectively reduce pressure on the bladder to cause expansion, and then selectively increase hydraulic pressure to assist with a dispense action.Type: ApplicationFiled: August 11, 2017Publication date: February 15, 2018Inventors: Anton J. deVilliers, Ronald Nasman, David Travis, James Grootegoed, Norman A. Jacobson, JR.