Patents by Inventor Ronald NEHRING

Ronald NEHRING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-cost superior performance coinless RF power amplifier
    Patent number: 10912185
    Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14), a drain lead (13) and a source contact surface (15). An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: February 2, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Reginald Simpson, Ronald Nehring, Mokhtar Rouabhi
  • Method for mounting a power amplifier (AP) assembly
    Patent number: 10842028
    Abstract: Methods for mounting a power amplifier (PA) assembly having an extended heat slug (11) are disclosed. According to one aspect, a method includes manufacturing a left side PCB (22a) and a right side PCB (22b). The method further includes sliding the left side PCB and the right side PCB inward (30) to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA (13) and so that the other of the left and right side PCB is in a position to contact a gate of the PA (14).
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: November 17, 2020
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Ronald Nehring, Mokhtar Rouabhi, Reginald Simpson
  • SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER
    Publication number: 20180310416
    Abstract: Methods for mounting a power amplifier (PA) assembly having an extended heat slug (11) are disclosed. According to one aspect, a method includes manufacturing a left side PCB (22a) and a right side PCB (22b). The method further includes sliding the left side PCB and the right side PCB inward (30) to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA (13) and so that the other of the left and right side PCB is in a position to contact a gate of the PA (14).
    Type: Application
    Filed: June 16, 2016
    Publication date: October 25, 2018
    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Ronald NEHRING, Mokhtar ROUABHI, Reginald SIMPSON
  • LOW-COST SUPERIOR PERFORMANCE COINLESS RF POWER AMPLIFIER
    Publication number: 20170374731
    Abstract: Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.
    Type: Application
    Filed: June 16, 2016
    Publication date: December 28, 2017
    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Reginald SIMPSON, Ronald NEHRING, Mokhtar ROUABHI