Abstract: Heat is removed from silicon devices in an integrated circuit package by means of a thermal liquid material contained in a film mounted on the underside of a cover enclosing the integrated circuit device. The film is electrically non-conductive and the film with the enclosed thermal liquid material form a formable pillow such that after the chip/substrate are assembled, the cover with the film containing the thermal liquid material is placed over the substrate and sealed thereto in a manner such that the film comes into direct contact with the top of the chips mounted on the substrate. This provides a direct heat transfer from the chip through the film to the thermal liquid material out to the cover, which may be formed as a heat radiator.