Abstract: When the electrodeposition of nickel is carried out in the presence of sulphur, it is desirable to control the content and the distribution of the sulphur in the deposited nickel. Sulphur-bearing nickel is deposited onto a multiplicity of cathodes (12) in an electrolytic cell. The electrolyte contains nickel ions, chloride ions, and at least one thiocyanate compound. To prevent oxidation of the thiocyanate ions by the chlorine gas generated at the anode (11), the chlorine is almost completely excluded from the cathode compartment by providing a flow of electrolyte from the cathode (12) to the anode (11) and by continuously removing chlorine and chlorine-containing electrolyte from the anode through a manifold (26). A weir (14) prevents back flow.

Abstract: A reusable integrated cathode unit and an associated electrolytic method are disclosed for the simultaneous production of a multiplicity of metal electrodeposits by plating from a base metal electrolyte. The rigid cathode unit has two integrated components, a slab of non-conductive material and a metal assembly which is embedded therein. The metal assembly has projections that penetrate the slab surface at spaced locations thereby forming an array of conductive metal islands flush with or raised above the surface of the cathode unit which serve as the sites for plating of the electrodeposits. The method is advantageously characterized by the production of unique, crown shaped electrodeposits with basal areas much larger than the areas of the conductive islands on which they are formed, and a significant component of growth in a direction normal to the plating surface.

Abstract: A reusable integrated cathode unit and an associated electrolytic method are disclosed for the simultaneous production of a multiplicity of metal electrodeposits by plating from a base metal electrolyte. The rigid cathode unit has two integrated components, a slab of non-conductive material and a metal assembly which is embedded therein. The metal assembly has projections that penetrate the slab surface at spaced locations thereby forming an array of conductive metal islands flush with or raised above the surface of the cathode unit which serve as the sites for plating of the electrodeposits. The method is advantageously characterized by the production of unique, crown shaped electrodeposits with basal areas much larger than the areas of the conductive islands on which they are formed, and a significant component of growth in a direction normal to the plating surface.