Abstract: A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.

Abstract: A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.

Abstract: An apparatus for communicating information between customer locations and remote locations desiring the information exchange which allows the communications to occur over existing communications lines without interfering with the existing uses of those lines. The apparatus includes an acquisition device located at the customer's location, and a signal shifting means located at a local distribution point in relatively close proximity to the customer's location which receives an out-of-band signal from the customer location and converts it to an in-band signal transmitted over the greater distance to the remote location desiring the information exchange using normal telephone transmission through telephone company switch equipment.