Abstract: In one aspect, a method to assign observations includes receiving first observations of a first sensor system, receiving second observations of a second sensor system and assigning a set of pairs of the first and second observations predicted to correspond to the same physical position. The assigning includes using a likelihood function that specifies a likelihood for each assigned pair. The likelihood is dependent on the assignment of any other assigned pairs in the set of assigned pairs. The assigning also includes determining the set of assigned pairs for the first and second observations based on the likelihood function. The likelihood function uses a gate value determined from estimating a true volume using nearest neighbor distances determined from the first and second observations.

Abstract: In one aspect, a method to assign observations includes receiving first observations of a first sensor system, receiving second observations of a second sensor system and assigning a set of pairs of the first and second observations predicted to correspond to the same physical position. The assigning includes using a likelihood function that specifies a likelihood for each assigned pair. The likelihood is dependent on the assignment of any other assigned pairs in the set of assigned pairs. The assigning also includes determining the set of assigned pairs for the first and second observations based on the likelihood function. The likelihood function uses a gate value determined from estimating a true volume using nearest neighbor distances determined from the first and second observations.

Abstract: An infrared detector array having a plurality of infrared detectors arranged in a matrix of rows and columns in a first semiconductor body; and, a plurality of integration/read circuits arranged in a matrix of rows and columns in a second semiconductor body, each one of the plurality of integration/read circuits being in vertical registration with, and electrically connected to, a corresponding one of the plurality of detectors. Each one of the integration/read circuits includes: a capacitor; a first transistor, electrically coupling the capacitor and the corresponding one of the detectors during an integration mode, for enabling current generated in the detector in response to impinging radiation to pass from the detector to the capacitor for integration; and a second transistor, electrically coupling the charge built-up on the capacitor during the integration mode to an output bus during a subsequent read mode.

Abstract: The present invention is an improvement on the thermal imaging detector of Elliott (U.S. Pat. No. 3,995,195). This detector, which has come to be called the SPRITE detector (Signal PRocessing In The Element), is being applied in serially scanned thermal imaging systems for the 8-12 micrometer infrared spectral band. All such SPRITE detectors to date have been three terminal devices, including two bias contacts at either end of the detector, and one additional readout electrode which, together with the nearby bias contact, define the readout zone across which the integrated photoconductive signal voltage is measured. The present invention recognizes that using a bias contact as one of the two readout electrodes can substantially reduce the spatial frequency response of the SPRITE detector. Thus, the present invention utilizes a four-terminal SPRITE detector configuration in which readout is achieved in a differential manner across two voltage probes.

Abstract: A device and process for determining the vacuum dewar heat load at cryogenic temperatures by a test made at room temperature are described. The test device comprises a heat source and integral temperature sensor mounted on a probe tip. The heat load of a test dewar at a desired test temperature (e.g. 77K) may be determined by measuring the heat load of the dewar under test at a more suitable test temperature (e.g. room temperature) and multiplying that room temperature heat load by a correlation factor. This correlation factor is empirically determined, and is dependent on the design of the test device and dewar, and the desired and actual test temperatures.