Abstract: A cooling apparatus for cooling a heat-generating chip mounted in a socket on a circuit board, the socket including a cradle having a standard heat-sink receiving configuration, includes an evaporator having a thermally conductive front face, a compressor in fluid communication with the evaporator for delivering refrigerant thereto, and an evaporator mount for coupling the evaporator to the heat-generating chip with the front face adjacent thereto. The mount includes a housing having coupling elements for connection to the cradle. The housing has an interior in which a housing insulation pack is provided for retaining the evaporator therein. The mount further includes a cradle insulation pack for maintaining the socket in moisture-free condition.