Patents by Inventor Ronald Schravendeel

Ronald Schravendeel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe structure for electronic packages
    Patent number: 8258611
    Abstract: A leadframe structure for an electronic package is provided, wherein the leadframe structure comprises a die-pad, a barrier area, and a bonding area, wherein the barrier area is arranged between the die-pad and the bonding area, and wherein the barrier area is adapted to electrically connect the die-pad and the bonding area, and is further constructed in such a way that delamination growth between the leadframe structure and a moulding compound fixable to the leadframe structure is reduced.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: September 4, 2012
    Assignee: NXP B.V.
    Inventors: Ronald Schravendeel, Peter Schelwald
  • LEADFRAME STRUCTURE FOR ELECTRONIC PACKAGES
    Publication number: 20100200973
    Abstract: A leadframe structure (100) for an electronic package is provided, wherein the leadframe structure (100) comprises a die-pad (103), a barrier area (114), and a bonding area (111), wherein the barrier area (114) is arranged between the die-pad (103) and the bonding area (111), and wherein the barrier area (111) is adapted to electrically connect the die-pad (103) and the bonding area (111), and is further constructed in such a way that delamination growth between the leadframe structure (100) and a moulding compound fixable to the leadframe structure (100) is reduced.
    Type: Application
    Filed: July 15, 2008
    Publication date: August 12, 2010
    Applicant: NXP B.V.
    Inventors: Ronald Schravendeel, Peter Schelwald