Abstract: A system for analyzing a fluid includes or uses a movable flow cell assembly being disposed in an analysis location on a wall of an analysis instrument and being configured to be retained by a locking assembly on a first surface of the wall. The system includes a probe head assembly located on an opposed second surface of the wall, the probe head assembly to direct an X-ray source to analyze the fluid in a static state in the movable flow cell assembly or in a flow mode through the movable flow cell assembly. The movable flow cell assembly and the probe head assembly are in electro-magnetic communication for elemental analysis of the fluid using the X-ray source when the movable flow cell assembly is retained by the locking assembly on the first surface of the wall.

Abstract: A system for analyzing a fluid includes or uses a movable flow cell assembly being disposed in an analysis location on a wall of an analysis instrument and being configured to be retained by a locking assembly on a first surface of the wall. The system includes a probe head assembly located on an opposed second surface of the wall, the probe head assembly to direct an X-ray source to analyze the fluid in a static state in the movable flow cell assembly or in a flow mode through the movable flow cell assembly. The movable flow cell assembly and the probe head assembly are in electro-magnetic communication for elemental analysis of the fluid using the X-ray source when the movable flow cell assembly is retained by the locking assembly on the first surface of the wall.

Abstract: A system for analyzing a fluid includes an integrated fluid-electric cabinet having a fluid compartment and an electronic compartment. The fluid compartment and an electronic compartment are separated from one another by a partition wall. The partition wall includes opposed first and second surfaces. A flow cell assembly is disposed in the fluid compartment and is configured to be mounted on the first surface side of the partition wall. A probe head assembly is disposed in the electronic compartment and is mounted on the opposed second surface side of the partitioned wall. Both of the flow cell assembly and the probe head assembly are configured to be in electro-magnetic communication with one another for elemental analysis of the fluid such that the probe head assembly utilizes an X-ray source to analyze the fluid in a static mode or in flow mode through the flow cell assembly.

Abstract: A system for analyzing a fluid includes an integrated fluid-electric cabinet having a fluid compartment and an electronic compartment. The fluid compartment and an electronic compartment are separated from one another by a partition wall. The partition wall includes opposed first and second surfaces. A flow cell assembly is disposed in the fluid compartment and is configured to be mounted on the first surface side of the partition wall. A probe head assembly is disposed in the electronic compartment and is mounted on the opposed second surface side of the partitioned wall. Both of the flow cell assembly and the probe head assembly are configured to be in electro-magnetic communication with one another for elemental analysis of the fluid such that the probe head assembly utilizes an X-ray source to analyze the fluid in a static mode or in flow mode through the flow cell assembly.

Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.

Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.

Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.