Abstract: The present disclosure provides a method of repairing a damaged portion of a panel formed of composite material. The method includes preparing the damaged portion for repair and applying a pressure responsive adhesive layer to substantially cover the damaged portion. The method also includes disposing a vacuum-assisted resin transfer molding repair patch assembly to substantially cover the damaged portion and substantially covering the repair patch assembly with a vacuum bag assembly. Resin is introduced into and impregnates the repair patch assembly. The repair patch assembly is cured after being impregnated.

Abstract: Apparatuses and methods are disclosed for determining whether a structure of bonded layers includes locations where the layers are weakly bonded. Embodiments include evaluating the frequency response of the structure in response to vibrational inputs. Alternate embodiments include evaluating the non-linear response of the structure using a modal analysis. Further embodiments include obtaining the vibrational information with an accelerometer contacting the structure, while additional embodiments include exciting the structure with an impact force, which may be applied at multiple locations on the structure's surface. Still further embodiments include performing a MAC, COMAC, and/or FRF analysis. Still other embodiments include varying the amplitude of the input vibration. Additional embodiments locate the areas of weakened bonding. Still other embodiments include methods and apparatuses for simulating a laminated structure with defective bonding, such as kiss bonding.

Abstract: The present disclosure provides a method of repairing a damaged portion of a panel formed of composite material. The method includes preparing the damaged portion for repair and applying a pressure responsive adhesive layer to substantially cover the damaged portion. The method also includes disposing a vacuum-assisted resin transfer molding repair patch assembly to substantially cover the damaged portion and substantially covering the repair patch assembly with a vacuum bag assembly. Resin is introduced into and impregnates the repair patch assembly. The repair patch assembly is cured after being impregnated.

Abstract: Apparatuses and methods are disclosed for determining whether a structure of bonded layers includes locations where the layers are weakly bonded. Embodiments include evaluating the frequency response of the structure in response to vibrational inputs. Alternate embodiments include evaluating the non-linear response of the structure using a modal analysis. Further embodiments include obtaining the vibrational information with an accelerometer contacting the structure, while additional embodiments include exciting the structure with an impact force, which may be applied at multiple locations on the structure's surface. Still further embodiments include performing a MAC, COMAC, and/or FRF analysis. Still other embodiments include varying the amplitude of the input vibration. Additional embodiments locate the areas of weakened bonding. Still other embodiments include methods and apparatuses for simulating a laminated structure with defective bonding, such as kiss bonding.