Patents by Inventor Ronald V. Smith

Ronald V. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8240031
    Abstract: A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: August 14, 2012
    Assignee: Endicott International Technologies, Inc.
    Inventors: Voya R. Markovich, Ronald V. Smith, How T. Lin, Frank D. Egitto, Rabindra N. Das, William E. Wilson, Rajinder S. Rai
  • Publication number: 20120015532
    Abstract: A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.
    Type: Application
    Filed: July 16, 2010
    Publication date: January 19, 2012
    Applicant: Endicott Interconnect Technologies, Inc.
    Inventors: Voya R. Markovich, Ronald V. Smith, How T. Lin, Frank D. Egitto, Rabindra N. Das, William E. Wilson, Rajinder S. Rai
  • Patent number: 7629559
    Abstract: A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: December 8, 2009
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Subahu D. Desai, John M. Lauffer, How T. Lin, Voya R. Markovich, Ronald V. Smith
  • Patent number: 7441709
    Abstract: An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: October 28, 2008
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: Benson Chan, How T. Lin, Voya R. Markovich, Ronald V. Smith
  • Patent number: 6982387
    Abstract: A method and associated structure for forming a conductive path within a laminate. A conductive element is presses into an opening in the laminate such that portion of at least one end of the conductive element extends beyond a surface of the laminate. A compressive pressure is applied to the portion of the at least one end of the conductive element. The compressive pressure applied to the at least one end of the conductive element forms a contact pad extending beyond the surface of the laminate. The conductive element may include an inner element covered by an outer element.
    Type: Grant
    Filed: June 19, 2001
    Date of Patent: January 3, 2006
    Assignee: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Patent number: 6712261
    Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: March 30, 2004
    Assignee: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Publication number: 20030178471
    Abstract: An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
    Type: Application
    Filed: March 20, 2002
    Publication date: September 25, 2003
    Applicant: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Publication number: 20020189861
    Abstract: The present invention provides an interconnect between layers of a circuit board. A conductive object is embedded in the layer of a circuit board.
    Type: Application
    Filed: June 19, 2001
    Publication date: December 19, 2002
    Applicant: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Patent number: 4347997
    Abstract: A helicopter including a power absorber arranged to selectively absorb power from a sustaining rotor system during deceleration. In an illustrated embodiment for a helicopter having a single sustaining rotor, the power absorber comprises a tail rotor assembly having two tail rotors located one on each side of a tail cone, and a control operative to adjust the pitch setting of the tail rotors to provide lateral thrust forces in opposed directions with a net lateral thrust force in one direction in order to maintain a desired heading during deceleration.
    Type: Grant
    Filed: March 24, 1980
    Date of Patent: September 7, 1982
    Assignee: Westland Aircraft Limited
    Inventors: Geoffrey M. Byham, Ronald V. Smith