Patents by Inventor Ronald W. Laconto

Ronald W. Laconto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical planarization using nanodiamond
    Patent number: 9343321
    Abstract: A method for chemical mechanical polishing of a substrate includes polishing the substrate at a stock removal rate of greater than about 2.5 ?/min to achieve a Ra of not greater than about 5.0 ?. The substrate can be a III-V substrate or a SiC substrate. The polishing utilizes a chemical mechanical polishing slurry comprising ultra-dispersed diamonds and at least 80 wt % water.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: May 17, 2016
    Assignee: SAINT-GOBAIN CERMAICS & PLASTICS, INC.
    Inventors: Jun Wang, Ronald W. Laconto, Andrew G. Haerle
  • CHEMICAL MECHANICAL PLANARIZATION USING NANODIAMOND
    Publication number: 20150155181
    Abstract: A method for chemical mechanical polishing of a substrate includes polishing the substrate at a stock removal rate of greater than about 2.5 ?/min to achieve a Ra of not greater than about 5.0 ?. The substrate can be a III-V substrate or a SiC substrate. The polishing utilizes a chemical mechanical polishing slurry comprising ultra-dispersed diamonds and at least 80 wt % water.
    Type: Application
    Filed: February 6, 2015
    Publication date: June 4, 2015
    Inventors: Jun Wang, Ronald W. Laconto, Andrew G. Haerle
  • Chemical mechanical planarization using nanodiamond
    Patent number: 8980113
    Abstract: A method for chemical mechanical polishing of a substrate includes polishing the substrate at a stock removal rate of greater than about 2.5 ?/min to achieve a Ra of not greater than about 5.0 ?. The substrate can be a III-V substrate or a SiC substrate. The polishing utilizes a chemical mechanical polishing slurry comprising ultra-dispersed diamonds and at least 80 wt % water.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: March 17, 2015
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Jun Wang, Ronald W. Laconto, Andrew G. Haerle
  • Methods for machining inorganic, non-metallic workpieces
    Patent number: 8168075
    Abstract: A method of machining a workpiece includes applying a fluid between a fixed abrasive component and a workpiece, followed by translation of the fixed abrasive component and the workpiece relative to each other. The fluid contains an anti-clogging agent containing a phosphorus-containing organic chemistry.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: May 1, 2012
    Inventors: Ronald W. Laconto, Douglas E. Ward
  • Polishing slurries
    Patent number: 8105135
    Abstract: A polishing slurry includes liquid medium and particulate abrasive. The particulate abrasive includes soft abrasive particles, hard abrasive particles, and colloidal silica particles, wherein the soft abrasive particles have a Mohs hardness of not greater than 8 and the hard abrasive particles have a Mohs hardness of not less than 8, and wherein the soft abrasive particles and the hard abrasive particles are present at a weight ratio of not less than 2:1.
    Type: Grant
    Filed: September 29, 2006
    Date of Patent: January 31, 2012
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Ronald W. Laconto, Andrew G. Haerle
  • Methods for machine ceramics
    Patent number: 8025808
    Abstract: A method for machining a ceramic substrate containing Al, including providing a solution containing a phosphorus compound on the ceramic substrate; and machining the substrate with an abrasive.
    Type: Grant
    Filed: December 10, 2007
    Date of Patent: September 27, 2011
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Ronald W. Laconto, Douglas E. Ward
  • CHEMICAL MECHANICAL PLANARIZATION USING NANODIAMOND
    Publication number: 20100233880
    Abstract: A method for chemical mechanical polishing of a substrate includes polishing the substrate at a stock removal rate of greater than about 2.5 ?/min to achieve a Ra of not greater than about 5.0 ?. The substrate can be a III-V substrate or a SiC substrate. The polishing utilizes a chemical mechanical polishing slurry comprising ultra-dispersed diamonds and at least 80 wt % water.
    Type: Application
    Filed: March 12, 2010
    Publication date: September 16, 2010
    Applicant: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
    Inventors: Jun Wang, Ronald W. Laconto, Andrew G. Haerle
  • METHODS FOR MACHINING INORGANIC, NON-METALLIC WORKPIECES
    Publication number: 20080153397
    Abstract: A method of machining a workpiece includes applying a fluid between a fixed abrasive component and a workpiece, followed by translation of the fixed abrasive component and the workpiece relative to each other. The fluid contains an anti-clogging agent containing a phosphorus-containing organic chemistry.
    Type: Application
    Filed: December 13, 2007
    Publication date: June 26, 2008
    Applicant: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
    Inventors: Ronald W. Laconto, Douglas E. Ward
  • Methods for machine ceramics
    Publication number: 20080153396
    Abstract: A method for machining a ceramic substrate containing Al, including providing a solution containing a phosphorus compound on the ceramic substrate; and machining the substrate with an abrasive.
    Type: Application
    Filed: December 10, 2007
    Publication date: June 26, 2008
    Applicant: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
    Inventors: Ronald W. Laconto, Douglas E. Ward
  • Methods for machining ceramics
    Patent number: 7306748
    Abstract: A method for machining a ceramic substrate containing Al, including providing a slurry between a substrate and a machine tool, the slurry containing alumina abrasive and an additive including a phosphorus compound, and moving the substrate relative to the machine tool.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: December 11, 2007
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Ronald W. Laconto, Douglas E. Ward
  • Methods for machining ceramics
    Publication number: 20040226917
    Abstract: A method for machining a ceramic substrate containing Al, including providing a slurry between a substrate and a machine tool, the slurry containing alumina abrasive and an additive including a phosphorus compound, and moving the substrate relative to the machine tool.
    Type: Application
    Filed: April 25, 2003
    Publication date: November 18, 2004
    Applicant: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Ronald W. Laconto, Douglas E. Ward
  • Fixed abrasives for optical polishing
    Patent number: 6258136
    Abstract: An optical polishing tool comprises alpha alumina and ceria components in relative weight proportions of from 30:70 to 70:30 dispersed in a resin binder. Particularly preferred are coated abrasives. Such coated abrasives produce an improved optical polishing performance.
    Type: Grant
    Filed: July 26, 1999
    Date of Patent: July 10, 2001
    Assignee: Norton Company
    Inventors: Thomas G. Kinisky, Gwo Shin Swei, Dean B. Arvidson, Jr., Ronald W. Laconto, Sr., Rami Schlair
  • Optical polishing formulation
    Patent number: 5989301
    Abstract: An optical polishing slurry with alumina and ceria components is found to produce an improved polishing performance over either component used alone.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: November 23, 1999
    Assignee: Saint-Gobain Industrial Ceramics, Inc.
    Inventors: Ronald W. Laconto, Sr., Rami Schlair
  • Zirconia disk substrate having high surface finish
    Patent number: 5824386
    Abstract: This invention relates to polishing YTZP zirconia disk substrates with colloidal silica to achieve a surface roughness Ra of no more than 8 angstroms.
    Type: Grant
    Filed: August 15, 1997
    Date of Patent: October 20, 1998
    Assignee: Saint-Gobain/Norton Industrial Ceramics Corporation
    Inventors: Ronald W. Laconto, Sr., Oh-Hun Kwon