Patents by Inventor Ronald W. Whittaker
Ronald W. Whittaker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100146782Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: February 23, 2010Publication date: June 17, 2010Applicant: MULTI-FINELINE ELECTRONIX, INC.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Publication number: 20100127814Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: December 16, 2009Publication date: May 27, 2010Applicant: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Patent number: 7690110Abstract: A method for making plural plated through holes in a single circuit board via is provided. The method includes plating copper in the walls of said circuit board via to form a first plated through hole and applying a thin layer of first adhesive promotor to the surface of said plated via. The method further includes vacuum depositing an organic layer having a high dielectric strength unto said layer of first adhesive promoter and applying a second layer of adhesive promoter over said organic layer. The method even further includes plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.Type: GrantFiled: August 24, 2007Date of Patent: April 6, 2010Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D Guerra, Ciprian Marcoci
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Patent number: 7656263Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: September 18, 2008Date of Patent: February 2, 2010Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Patent number: 7602272Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: August 24, 2007Date of Patent: October 13, 2009Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D Guerra, Ciprian Marcoci
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Publication number: 20090015364Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: September 18, 2008Publication date: January 15, 2009Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Patent number: 7436282Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: July 6, 2007Date of Patent: October 14, 2008Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Patent number: 7271697Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: December 7, 2005Date of Patent: September 18, 2007Assignee: Multi-Fineline ElectronixInventors: Ronald W. Whittaker, Joe D Guerra, Ciprian Marcoci
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Publication number: 20010000394Abstract: An electric bicycle assembly provided with a lightweight, high performance DC electric motor and a tuned centrifugal slip clutch assembly in combination therewith. This bicycle assembly includes a two-stage start-run electric control circuitry which prevents high motor zero rpm in-rush currents which may damage the motor.Type: ApplicationFiled: November 30, 2000Publication date: April 26, 2001Inventor: Ronald W. Whittaker
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Publication number: 20010000284Abstract: An electric bicycle assembly provided with a lightweight, high performance DC electric motor and a tuned centrifugal slip clutch assembly in combination therewith. This bicycle assembly includes a two-stage start-run electric control circuitry which prevents high motor zero rpm in-rush currents which may damage the motor.Type: ApplicationFiled: November 30, 2000Publication date: April 19, 2001Inventor: Ronald W. Whittaker
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Patent number: 6155369Abstract: An electric bicycle assembly provided with a lightweight, high performance DC electric motor and a tuned centrifugal slip clutch assembly in combination therewith. This bicycle assembly includes a two-stage start-run electric control circuitry which prevents high motor zero rpm in-rush currents which may damage the motor. Another embodiment of this invention utilizes a variable ratio V-belt drive assembly having a centrifugal clutch capability so as to engage and disengage at a predetermined RPM. Another embodiment of this invention is provided with a front wheel mounted regenerating wheel rotor assembly which is adapted to recharge batteries as needed. Another embodiment of this invention utilizes a mechanically actuated multi-stage power control switch so as to selectively provide a start circuit and two or more power control levels in the operational use thereof.Type: GrantFiled: March 26, 1998Date of Patent: December 5, 2000Inventor: Ronald W. Whittaker