Patents by Inventor Ronald Wayne Toten

Ronald Wayne Toten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11835364
    Abstract: An environmental sensor device with a sensor enclosure is configured for use in a gas environment. An enclosure support, at least one sensor on a face of the enclosure; and at least one debris sloughing structure is used. The debris sloughing structure is composed of a channel with a set of inner and outer ridges disposed in the enclosure around a periphery of the at least one sensor, wherein a top portion of the debris sloughing structure above the at least one sensor and lateral portions of the debris sloughing structure on lateral sides of the at least one sensor. A shape and arrangement of the debris sloughing structure carries condensate or contaminants forming on non-sensor areas of the enclosure away from the sensor and to a bottom portion of the enclosure.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: December 5, 2023
    Assignee: HADRONEX, INC.
    Inventors: David B Rees, Ronald Wayne Toten, Lawrence Brian Merchell
  • Publication number: 20210231469
    Abstract: An environmental sensor device with a sensor enclosure is configured for use in a gas environment. An enclosure support, at least one sensor on a face of the enclosure; and at least one debris sloughing structure is used. The debris sloughing structure is composed of a channel with a set of inner and outer ridges disposed in the enclosure around a periphery of the at least one sensor, wherein a top portion of the debris sloughing structure above the at least one sensor and lateral portions of the debris sloughing structure on lateral sides of the at least one sensor. A shape and arrangement of the debris sloughing structure carries condensate or contaminants forming on non-sensor areas of the enclosure away from the sensor and to a bottom portion of the enclosure.
    Type: Application
    Filed: January 29, 2021
    Publication date: July 29, 2021
    Inventors: David B. Rees, Ronald Wayne Toten, Lawrence Brian Merchell