Abstract: A substrate is processed in a device having a vacuum chamber, at least one sputtering chamber, and a flow channel connecting the vacuum chamber to the sputtering chamber. According to the method, material is sputtered onto the substrate located in the sputtering chamber so that a sputtering gas flux amount is consumed by deposition onto the substrate. Prior to and during sputtering, sputtering gas flux flows into the vacuum chamber so that the total amount of sputtering gas flux flowed into the vacuum chamber prior to sputtering is substantially equal to the sputtering gas flux amount. At least during sputtering, the vacuum chamber is maintained at a partial pressure in a range of from more than 1.times.10.sup.-5 mbar up to 5.times.10.sup.-3 mbar.

Abstract: The invention relates to an installation for manufacturing registration carriers provided with an injection molding device and with two holders supporting molding plates, which are adjustable with respect to each other between a first position, in which said molding plates bound a mold cavity, into which a material is injected by the injection molding device during operation so as to form the registration carrier, and a second position, in which the molding plates have been moved some distance apart with a view to removing the registration carrier formed. Transport means are provided on either side of the injection molding device, to move a holder supporting a molding plate from a position located at some distance from the injection molding device to a position suitable for cooperation with the injection molding device, and/or from a position suitable for cooperation with the injection molding device to a position located at some distance from the injection molding device.