Abstract: A thermal bend actuator includes: a thermoelastic beam for connection to drive circuitry; and a passive beam mechanically cooperating with the thermoelastic beam, such that when a current is passed through the thermoelastic beam, the thermoelastic beam expands relative to the passive beam resulting in bending of the actuator. The thermoelastic beam wherein the thermoelastic beam is comprised of an aluminium alloy. The aluminium alloy comprises a first metal which is aluminium, a second metal, and at least 0.1 at. % of a third metal selected from the group consisting of: copper, scandium, tungsten, molybdenum, chromium, titanium, silicon and magnesium.

Abstract: A thermal bend actuator includes: a thermoelastic beam for connection to drive circuitry; and a passive beam mechanically cooperating with the thermoelastic beam, such that when a current is passed through the thermoelastic beam, the thermoelastic beam expands relative to the passive beam resulting in bending of the actuator. The thermoelastic beam wherein the thermoelastic beam is comprised of an aluminium alloy. The aluminium alloy comprises a first metal which is aluminium, a second metal, and at least 0.1 at. % of a third metal selected from the group consisting of: copper, scandium, tungsten, molybdenum, chromium, titanium, silicon and magnesium.

Abstract: A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate. The process includes the steps of: (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface; (ii) forming the inkjet nozzle devices on the frontside surface using MEMS fabrication steps; and (iii) removing the first and second polymers via oxidative ashing, wherein first and second polymers are different.

Abstract: A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate. The process includes the steps of: (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface; (ii) forming the inkjet nozzle devices on the frontside surface using MEMS fabrication steps; and (iii) removing the first and second polymers via oxidative ashing, wherein first and second polymers are different.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.

Abstract: A planar micro-reagent cartridge comprises a base layer having a fluid receiving cavity formed in a top surface thereof and a fluid disposed within the cavity, and intermediate layer and a top layer. The intermediate membrane layer is bonded to the base layer to seal the fluid receiving cavity and form a fluid reservoir pump chamber. The intermediate layer comprises a resiliently deformable flexible region that overlies the fluid receiving cavity and is configured to be depressed in response to application of pressure, and a rupturable valve region that overlies the fluid receiving cavity. A top layer is bonded to the intermediate layer, the top layer having an opening that exposes the deformable flexible region of the intermediate membrane layer and at least one channel that together with the intermediate membrane layer forms a fluid conduit having an inlet in fluid communication with the rupturable valve region of the intermediate layer.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a photoimageable thermoplastic polymer onto the frontside surface and into each hole; (ii) reflowing the polymer; (iii) selectively removing the polymer from regions outside a periphery of each hole, the selective removing comprising exposure and development of the polymer; (iv) optionally repeating steps (i) to (iii) until each hole is overfilled with the polymer; and (v) planarizing the frontside surface to provide one or more holes filled with a plug of the polymer. Each plug has a respective upper surface coplanar with the frontside surface.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a photoimageable thermoplastic polymer onto the frontside surface and into each hole; (ii) reflowing the polymer; (iii) selectively removing the polymer from regions outside a periphery of each hole, the selective removing comprising exposure and development of the polymer; (iv) optionally repeating steps (i) to (iii) until each hole is overfilled with the polymer; and (v) planarizing the frontside surface to provide one or more holes filled with a plug of the polymer. Each plug has a respective upper surface coplanar with the frontside surface.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole; (ii) reflowing the first polymer; (iii) exposing the wafer substrate to a controlled oxidative plasma; (iv) optionally repeating steps (i) to (iii); (v) depositing a layer of a photoimageable second polymer; (vi) selectively removing the second polymer from regions outside a periphery of the holes using exposure and development; and (vii) planarizing the frontside surface to provide holes filled with a plug comprising the first and second polymers, which are different than each other. Each plug has a respective upper surface coplanar with the frontside surface.

Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: (i) depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole; (ii) reflowing the first polymer; (iii) exposing the wafer substrate to a controlled oxidative plasma; (iv) optionally repeating steps (i) to (iii); (v) depositing a layer of a photoimageable second polymer; (vi) selectively removing the second polymer from regions outside a periphery of the holes using exposure and development; and (vii) planarizing the frontside surface to provide holes filled with a plug comprising the first and second polymers, which are different than each other. Each plug has a respective upper surface coplanar with the frontside surface.

Abstract: A planar micro-reagent cartridge comprises a base layer having a fluid receiving cavity formed in a top surface thereof and a fluid disposed within the cavity, and intermediate layer and a top layer. The intermediate membrane layer is bonded to the base layer to seal the fluid receiving cavity and form a fluid reservoir pump chamber. The intermediate layer comprises a resiliently deformable flexible region that overlies the fluid receiving cavity and is configured to be depressed in response to application of pressure, and a rupturable valve region that overlies the fluid receiving cavity. A top layer is bonded to the intermediate layer, the top layer having an opening that exposes the deformable flexible region of the intermediate membrane layer and at least one channel that together with the intermediate membrane layer forms a fluid conduit having an inlet in fluid communication with the rupturable valve region of the intermediate layer.