Abstract: A device for fiber optic free-space optical communication between electronic components, having no physical communication connection, in which terminal ends of optical fibers are aligned such that light emitting from the terminal end of one optical fiber is transmitted across free-space and received by the terminal end of another optical fiber. The light thusly received is transmitted to a corresponding transceiver, to which the optical fiber is connected, deployed on the electronic component, thereby establishing optical communication between two transceivers across the free-space separating the two terminal ends.

Abstract: A device for fiber optic free-space optical communication between electronic components, having no physical communication connection, in which terminal ends of optical fibers are aligned such that light emitting from the terminal end of one optical fiber is transmitted across free-space and received by the terminal end of another optical fiber. The light thusly received is transmitted to a corresponding transceiver, to which the optical fiber is connected, deployed on the electronic component, thereby establishing optical communication between two transceivers across the free-space separating the two terminal ends.

Abstract: A system for cooling an IC using a cold plate heatsink employs at least one adjustable thermally-conductive extension segment extending therefrom. The system deploys an elastically compressible thermally-conductive shock absorbing pad between, and in contact with both, a contact face of the extension segment and a contact surface of an electrical component, such as an IC, so as to form a substantially physically-continuous thermally-conductive heat transfer mechanism while protecting the electrical component from being damaged by direct contact with the extension segment.