Abstract: A method for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor, carrying out a preheating process, carrying out an adhesive application process, carrying out an optical unit mounting process, and carrying out a packaging process. Due to the preheating process, the semimanufacture will be subjected to a stabilized process environment during the adhesive application process and the optical unit mounting process, so as for the optical unit to remain highly flat once attached to the semimanufacture. The method reduces the chances of tilt and crack of the optical unit and thereby contributes to a high yield rate.

Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

Abstract: A two-stage packaging method of image sensors is disclosed. The packaging method includes the following steps: providing a substrate, fixing an image sensor chip on the substrate, fixing a transparent board on the image sensor chip, electrically connecting the image sensor chip and the substrate, forming a first encapsulant lay, and forming a second encapsulant layer. The two-stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process. Such excessive pressure, if generated, may result in position shift of the image sensor chip or damage of the bonding wires. The two-stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors, thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs.

Abstract: The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.

Abstract: The present invention discloses a structure and a manufacturing method for a high-resolution camera module, wherein the method includes the following steps: providing an image sensor wafer comprising multiple image sensor chips; performing inspection and defining if each image sensor chip is a good chip; disposing an optical cover on the image sensor chip defined as the good chip, wherein the optical cover faces a sensing area and does not cover conductive contacts; cutting the image sensor wafer to obtain the discrete image sensor chip covered with the optical cover; and disposing a first surface of the divided image sensor chip on a bottom surface of a ceramic substrate. The present invention can seal the high resolution camera module during early stage of the manufacturing process to improve the yield rate of the camera module, and downsize the camera module effectively.