Patents by Inventor Rong Cui

Rong Cui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124469
    Abstract: A compound having a structure as shown in general formula (I), a deuterated compound, a stereoisomer, or a pharmaceutically acceptable salt thereof, a pharmaceutical composition comprising same, and use thereof. The compound has a good PIM kinase inhibitory effect, is a novel and ideal PIM inhibitor having high activity and low toxicity, and can be used for treating and/or preventing hematoma such as acute myeloid leukemia, bone marrow fibrosis and chronic lymphocytic leukemia, solid tumors such as gastric cancer and prostate cancer, and other diseases.
    Type: Application
    Filed: January 29, 2022
    Publication date: April 18, 2024
    Inventors: Xin YANG, Rong CUI, Jianming YIN, Mei ZHENG, Nanyu CHEN, Yubin LV
  • Patent number: 11317511
    Abstract: The present disclosure provides a circuit board. The circuit board may include a number of stacked core boards each having a top surface. At least part core boards of the number of stacked core boards may include circuit layers at top surfaces thereof. A groove may be defined through the at least part core boards. A conductive material may be received in the groove configured to couple to the circuit layers of at least two core boards. A cross section of the groove may include a length in a first direction and a length in a second direction, and the length in the first direction may be greater than the length in the second direction. Electroplating solution may capable of contacting any portions of the groove to electroplate, to form the conductive material.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: April 26, 2022
    Assignee: SHENNAN CIRCUITS CO., LTD.
    Inventors: Zhi Li, Xuechuan Han, Rong Cui, Zhenbo Liu
  • Publication number: 20210084761
    Abstract: The present disclosure provides a circuit board. The circuit board may include a number of stacked core boards each having a top surface. At least part core boards of the number of stacked core boards may include circuit layers at top surfaces thereof. A groove may be defined through the at least part core boards. A conductive material may be received in the groove configured to couple to the circuit layers of at least two core boards. A cross section of the groove may include a length in a first direction and a length in a second direction, and the length in the first direction may be greater than the length in the second direction. Electroplating solution may capable of contacting any portions of the groove to electroplate, to form the conductive material.
    Type: Application
    Filed: November 6, 2020
    Publication date: March 18, 2021
    Inventors: ZHI LI, Xuechuan Han, Rong Cui, Zhenbo Liu
  • Patent number: 5789385
    Abstract: Compounds that possess selectin binding activity are described that have a three-dimensionally stable configuration for sialic acid and fucose, or analogs, derivatives, or mimics of these groups, such that sialic acid and fucose or their mimics are separated by a linker that permits binding between those groups and the selecting, such compounds being represented by the following general structural formula I: ##STR1##
    Type: Grant
    Filed: February 21, 1996
    Date of Patent: August 4, 1998
    Assignee: Glycomed Incorporated
    Inventors: Mark B. Anderson, Daniel E. Levy, Peng Cho Tang, John H. Musser, Narasinga Rao, Jing Rong Cui
  • Patent number: D999124
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: September 19, 2023
    Inventor: Rong Cui