Patents by Inventor Rong F. Huang

Rong F. Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5431718
    Abstract: A high adhesion strength, co-fireable, solderable silver metallization material for use with low-fire ceramics is provided. The metallization material includes the metallization powder as well as a binder vehicle, and an adhesion promoting agent. The combination of elements allows a metallization material which can be cofired at relatively low temperatures necessary for firing ceramic substrate materials while providing an adequate base for soldering subsequent circuit components to the ceramic substrate.
    Type: Grant
    Filed: July 5, 1994
    Date of Patent: July 11, 1995
    Assignee: Motorola, Inc.
    Inventors: James H. Lombard, Rong F. Huang
  • Patent number: 4997812
    Abstract: An Ytrium Barium Copper Oxide-based thick-film paste is disclosed, which when deposited on an alumina substrate is superconducting above the termperature of liquid nitrogen and substantially free of mechanical defects such as cracking or peeling. A method of applying the paste, including the curing process, insures that the YBC superconductor is boned to the substrate.
    Type: Grant
    Filed: September 12, 1988
    Date of Patent: March 5, 1991
    Assignee: Motorola, Inc.
    Inventor: Rong F. Huang
  • Patent number: 4872086
    Abstract: Ceramic dielectric substrates, calcium titanate, bismuth titanate and strontium titanate, used with superconductor, Ytrium Barium Copper Oxide, or YBC, as an electrode, produce a superconducting electrical device, useable as a filter or capacitor. The electrical device formed by using one of the dielectrics taught herein in combination with YBC, is mechanically stable in comparison to prior art ceramic dielectrics that used YBC for an electrode material, in that the YBC is substantially free of microcracks and remains bonded to the substrates.
    Type: Grant
    Filed: October 20, 1988
    Date of Patent: October 3, 1989
    Assignee: Motorola, Inc.
    Inventors: Rong F. Huang, Wei-Yean Howng