Abstract: Electronic devices are provided. An electronic device includes a main body, a first casing, a second casing, a first rod, a second rod and a slider movable along a rail of the main body. The first casing includes a first hinge, and the second casing includes a second hinge. The first rod pivotally connects the slider and the first hinge, and the second rod pivotally connects the slider and the second hinge. When the slider moves between a first position and a second position of the rail, the first and second casings move in opposite directions with respect to the main body.

Abstract: A stacked structure of a BGA (Ball Grid Array) integrated circuit package arranged on a printed circuit board includes a lower IC package body, an upper IC package body and glue. The lower IC package body has a first surface and a second surface opposite to the first surface. The first surface is formed with a plurality of first contacts for electrically connecting to the printed circuit board. The second surface is formed with a plurality of second contacts for electrically connecting to the upper IC package body. The upper IC package body is stacked above the lower IC package body and electrically connected to the second contacts on the second surface of the lower IC package body. The glue is provided between the lower IC package body and the upper IC package body for covering and protecting the plurality of second contacts.