Abstract: A multilayer electronic component (200) is provided. The component includes a substrate package assembly (202) with a set of stacked insulated sheets of a dielectric ceramic material (204, 206, 208, 210, 212). Also included are a set of embedded resistors (214), each of the embedded resistors including an electrical input port pad (216) and an electrical output port pad (218) provided in layers between the set of stacked insulated sheets. Each of the insulated sheets has a trough (220) of a predetermined length aligned between and transverse to the electrical input port pad (216) and the electrical output port pad (218). The trough (220) reduces the resistance value variability in the multilayer electronic component (200). The trough (220) is substantially filled with a resistive paste material and an internal circuit (222) connects the embedded resistors inside the substrate package assembly (202). A method of forming the substrate package assembly (202) is also provided.

Abstract: A field emission display (100) includes a cathode plate (102) having a plurality of electron emitters (124), an anode plate (104) opposing the cathode plate (102), and a bulk-resistive spacer (108) extending between the anode plate (104) and the cathode plate (102). The bulk-resistive spacer (108) is made from an electrically conductive material. The resistivity of the electrically conductive material is selected to remove impinging charges while preventing excessive power loss due to electrical current through the bulk-resistive spacer (108) from the anode plate (104) to the cathode plate (102).

Abstract: Multiphase ceramic materials for use in electronic applications such as patch antennas and multilayered ceramic devices may be fabricated by providing a novel combination of a glassy precursor material with operable amounts of a high purity cordierite material. The combined materials are sintered at appropriate temperatures, so that a non-glassy celsian type phase is formed. The materials of the instant invention, fabricated according to the method disclosed herein, demonstrate low dielectric constant (K) and low electrical loss (high Q) characteristics.

Abstract: A laminated lowpass filter (100) is disclosed. The filter (100) has: a stack of dielectric substrates (301-312) having a ground via (118); a pi network coupled between an input (202) and an output (202'); a first leg comprising a first transmission line (608) and a first capacitance (C1) connected to a top ground plane (GP1); a second leg comprising a second transmission line (608') and a second capacitance (C2) connected to a bottom ground plane (GP2); a middle leg including a transmission line (606) is between the first and second leg; the single point ground plane configuration prevents ground loops and minimizes the passage of stray signals through the laminated lowpass filter (100).

Abstract: A dielectric paste material may be used in the fabrication of multilayered ceramic modules to create circuit elements. The dielectric paste is a multiphase material in which at least one phase is an alkaline earth metal, transition metal silicate. This yields a dielectric paste with extremely good K & Q values suitable for high frequency applications which significantly reduce manufacturing costs of modules.

Abstract: A method for producing input/output connections in a ceramic device is disclosed. The ceramic device can provide wraparound input/output connections. The method can include first providing first and second green ceramic layers, forming at least one via in each ceramic layer, the at least one via in the second layer being offset from and connecting to the via in the first ceramic layer, filling the vias with metallization, laminating the ceramic layers to form a laminate, scoring the laminate along at least one line extending through the first via and into a portion of the second ceramic layer such that the line does not intersect the at least one second via the ceramic laminate and metalization, and cleaving the laminate along the scored line. A ceramic device using this method can provide a wraparound connection extending partially up the side thereof, which can be advantageous in many multi-layer applications.

Abstract: What is described is a commonly coupled high frequency transmitting/receiving switching module (100). The switching module (100), has a transmitting circuit (102), a receiving circuit (104), an antenna circuit (106), an external circuit (108), a coupling circuit (110) and control circuits (124, 126). The switching module may be switched between one of four circuit paths (202, 204, 206, 208) each path incorporating an integral harmonic filter (210, 212). This structure is adapted for use in a multi-layer ceramic integrated circuit, and provides the advantage of minimizing current consumption with a minimal number of components.

Abstract: A switch circuit for a cellular radiotelephone operable in a TDMA communication scheme. The switch circuit is disposed upon a plurality of tandemly-positioned ceramic substrates having transmission lines disposed upon one of the ceramic substrates. The switch circuit alternately connects transmitter circuitry to an antenna or receiver circuitry to the antenna, thereby alternately to permit transmission or reception of signals generated by, or received by the radiotelephone. Because circuits disposed upon ceramic materials are of low insertion losses, the switch circuit is advantageously utilized to form a portion of the radiotelephone.

Abstract: A transmission line device (200) employs a first ground plane (118) that is disposed on a first dielectric substrate (202). A first conductive layer (210) that encloses a first area (213)is disposed on a second dielectric substrate (206), which substrate is positioned substantially adjacent to the first dielectric substrate (202). A second conductive layer (211) that encloses an area corresponding to the first area (213) is disposed on a third dielectric substrate (207), which substrate is positioned substantially adjacent to the second dielectric substrate (206). A coil structure is thereby provided that can be employed in the fabrication of a transmission line device, according to the invention.

Abstract: A palladium paste is utilized for forming a palladium film on a ceramic substrate. The paste includes a sinterable palladium powder dispersed in a vaporizable liquid vehicle. The paste also includes minor additions of titanium dioxide powder and a metal titanate powder. A preferred titanate powder is composed of strontium calcium titanate. It is found that the additions remarkably improve adhesion of the palladium film to the substrate.

Abstract: A high-frequency dielectric ceramic compound having a perovskite-type crystal structure comprising a chemical composition substantially represented by the formula (Sr.sub.x Ca.sub.y Mn.sub.z)TiO.sub.3 in which 0.98<x+y+z<1.02, 0.34<y<0.4, and 0.0075<z<0.0015, and possessing a non-linear temperature coefficient is set forth. A method is presented for utilizing the compound to formulate a high-frequency dielectric material, the formulated material being particularly suitable for providing filters and related applications with a relatively low resonant frequency temperature coefficient.

Abstract: A high-frequency dielectric ceramic compound having a perovskite-type crystal structure comprising a chemical composition substantially represented by the formula (Sr.sub.x Ca.sub.y Mn.sub.z)TiO.sub.3 in which 0.98<x+y+z<1.02,0.34<y<0.4, and 0.0075<z<0.015, and possessing a non-linear temperature coefficient is set forth. A method is presented for utilizing the compound to formulate a high-frequency dielectric material, the formulated material being particularly suitable for providing filters and related applications with a relatively low resonant frequency temperature coefficient.

Abstract: A first layer of titanium or tin is vapor deposited upon opposing major surfaces on the ceramic sensor. A second layer consisting of platinum, palladium or ruthenium is deposited over the first layer. The structure is then preferably annealed in air in order to crystallize the external layer to roughen the exterior surface and enhance adhesion. Lead wires, preferably made of Nichrome, are attached to the opposing surfaces by applying a conductive paste to the wire and surface functions, and firing the structure. The conductive paste provides a relatively low resistance, strong, mechanical bond between the lead wires and the roughened external surfaces of the structure. The first layer facilitates bonding of the second layer to the ceramic. The first and second layers cooperate to protect the ceramic from the potentially harmful glass frit contained in the conductive paste.