Abstract: This disclosure describes techniques for transmitting Bluetooth data over a contention-based communication link (such as a P2P link). In some instances, a wireless device transmits, to a Bluetooth-enabled peripheral device over the contention-based communication link, one or more first data packets based on a set of transmission parameters. The wireless device receives, from the Bluetooth-enabled peripheral device, a buffer status report carrying feedback information indicating one or more of a quantity of data packets queued in a receive buffer of the peripheral device, a rate at which the data packets are queued in the receive buffer, or time-of-arrival (TOA) information of the data packets queued in the receive buffer. The wireless device adjusts the set of transmission parameters based on the feedback information, and transmits, to the Bluetooth-enabled peripheral device over the contention-based communication link, one or more second data packets based on the adjusted set of transmission parameters.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a central device may transmit an indication that a first peripheral device is to, within each frame rendered by the central device, receive downlink data from the central device in a downlink slot and transmit available uplink data to the central device within one or more first service periods that are assigned to the first peripheral device in an uplink slot. The central device may transmit, based at least in part on the indication, a downlink message in a downlink slot of a frame. The central device may receive, based at least in part on the indication, a first uplink message in a first service period assigned to the first peripheral device in an uplink slot of the frame. Numerous other aspects are described.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a wireless communication device may receive a first beacon signal associated with a wireless access point associated with a gaming console, the first beacon signal indicating a first reference time value. The wireless communication device may obtain, associated with a first input time, a first indication of a first user input to a user input device, wherein the wireless communication device is associated with the user input device. The wireless communication device may transmit a first communication comprising first user input data, associated with the first indication, and a first input timing value indicating the first input time relative to the first reference time value. Numerous other aspects are described.

Abstract: This application provides an information feedback method and a related apparatus. In the method, a first apparatus sends, to a second apparatus, a first frame that carries a first field used to perform channel estimation, and the first apparatus receives a first feedback frame from the second apparatus. The first feedback frame includes channel state information CSI, the CSI is CSI from the first apparatus to the second apparatus, the CSI is obtained by the second apparatus by performing channel estimation based on the received first field and a second field, and the second field is not the first field.

Abstract: This application provides a communication method and an apparatus, to implement a channel sensing procedure between different apparatuses while meeting a communication requirement, thereby improving communication efficiency of a WLAN system and reducing overheads. In the method, a first apparatus sends a first frame to a second apparatus, where the first frame is used to request channel sensing; and the first apparatus receives a second frame from the second apparatus, where the second frame includes channel sensing information between the first apparatus and the second apparatus, the channel sensing information is determined based on a part of or all of n PPDUs, the n PPDUs are PPDUs sent by the first apparatus, and n is greater than or equal to 1.

Abstract: A testkey structure for semiconductor device includes a substrate, a gate structure disposed on the substrate, and a plurality of first dummy gate structures disposed on the substrate and arranged around the gate structure. A bottom surface of the gate structure is lower than bottom surfaces of the first dummy gate structures. A top surface of the gate structure is flush with top surfaces of the first dummy gate structures.

Abstract: The present invention relates to a polybutylene terephthalate composition, comprising (A) 40 to 99.8% by weight of polybutylene terephthalate, (B) 0.2 to 10% by weight of at least one conductive filler selected from the group consisting of carbon nanotubes, carbon nanostructures, and a combination thereof, and (C) 0 to 50% by weight of glass fiber, each being based on the total weight of the poly butylene terephthalate composition, wherein the carbon nanostructures each comprise a plurality of carbon nanotubes which are branched, crosslinked, and/or sharing common walls with one another. The present invention also relates to an EMI shielding article produced from the polybutylene terephthalate composition.

Abstract: A test key structure includes a substrate; a first metal pad disposed on the substrate; a second metal pad disposed in proximity to the first metal pad on the substrate; a gap between the first metal pad and the second metal pad; a first contact disposed on the first metal pad; and a second contact disposed on the second metal pad.

Abstract: The present invention provides a semiconductor device and a method of fabricating the same, which includes a substrate, a gate structure, and a dielectric layer. The gate structure is disposed on the substrate and includes an inverted trapezoidal shape. The dielectric layer is disposed on the substrate, and the gate structure is disposed within the dielectric layer. The gate structure includes a metal gate structure or a polysilicon gate structure.

Abstract: In a sensing session establishment process, an access point sends a first frame to a first station, where the first frame includes first information, the first information indicates a first role of the first station in a sensing session, the first role of the first station in the sensing session is a transmitter and/or a receiver, and the first station is a station participating in the sensing session in a second station associated with the access point; and the access point receives a second frame from the first station, where the second frame includes confirm information for the first frame.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a wireless communication device (WCD) may communicate, during a first communication period, with an audio device via a wireless link configured with a first service interval and a first service period. The WCD may communicate, during a second communication period, with the audio device via the wireless link configured with a second service interval and a second service period based at least in part on detection of a trigger condition comprising one or more of: a change of a signal strength, a change of one or more concurrent wireless links on one or more frequency bands that overlap with the wireless link, a change of a use state of the WCD, or a change in channel congestion or interference. Numerous other aspects are described.

Abstract: The present invention relates to a polybutylene terephthalate composition, comprising (A) 45 to 75% by weight of polybutylene terephthalate, (B) 20 to 45% by weight of at least one carbon fiber, (C) 0 to 20% by weight of at least one solid filler other than the carbon fiber (B), and (D) 0 to 30% by weight of at least one thermoplastic polyester other than polybutylene terephthalate, each being based on the total weight of the polybutylene terephthalate composition, wherein the at least one carbon fiber has a carbon content of 93% by weight or greater, and comprises a sizing agent other than epoxy sizing agent. The present invention also relates to an EMI shielding article produced from the polybutylene terephthalate composition.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, an access point may start a target wake time (TWT) service period (SP). The access point may receive an end of SP (EOSP) indication from a station. The access point may stop the TWT SP before a scheduled end of the TWT SP based on receiving the EOSP indication. Numerous other aspects are described.

Abstract: The system includes a job request collection and distribution module, a scheduling service module and a job execution service module. The job request collection and distribution module receives first description information of a job to be executed from a user terminal. A current scheduling service module matched with a job scheduling algorithm name in at least one scheduling service module determines a computing resource required by the job to be executed according to the first description information, and then determines a job scheduling result according to the required computing resource and currently available cluster computing resources. The job is submitted to a high-performance computer through a current job execution service module matched with a job execution service name in at least one job execution service module according to a device identifier and a global identifier of the job to be executed contained in the scheduling result.

Abstract: A testkey structure for semiconductor device includes a substrate, a gate structure disposed on the substrate, and a plurality of first dummy gate structures disposed on the substrate and arranged around the gate structure. A bottom surface of the gate structure is lower than bottom surfaces of the first dummy gate structures. A top surface of the gate structure is flush with top surfaces of the first dummy gate structures.

Abstract: A preparation method of a bacterial cellulose-defective molybdenum disulfide (BC-MoS2-x) heterojunction material for treating radioactive wastewater is provided, including: preparing bacterial cellulose by the in situ growth technology of Acetobacter xylinum, and freeze-drying to obtain dried bacterial cellulose; carbonizing the dried bacterial cellulose to obtain carbonized bacterial cellulose; dispersing the carbonized bacterial cellulose into deionized water under an ultrasonic treatment; then adding thiourea and Na2MoO4.2H2O, dissolving under an ultrasonic treatment to obtain a reaction mixture, subjecting the reaction mixture to a hydrothermal reaction to obtain a BC-MoS2 heterojunction; and calcining the BC-MoS2 heterojunction in a tube furnace with an Ar/H2 atmosphere to obtain the BC-MoS2-x heterojunction.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: An interventional operation isolation transfer cabin includes a cabin body, and a lead wire access device and a wire in/out device which two are mounted on the cabin body, the cabin body is provided with a negative pressure generating device at one end and an air inlet at the other end, the negative pressure generating device is provided with an exhaust filter device at its air outlet, and an intake filter device is provided at the air inlet. Several operating openings are provided on side walls of the cabin body, each of the operating openings is in seal connection with an operating glove, and a glove opening of at least one operating glove faces an interior of the cabin body. Equipment wires required by an interventional operation are preset through the lead wire access device, and wires added midway under a sealing condition is guaranteed through the wire in/out device.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.