Abstract: An array substrate and a display device. The array substrate includes a base substrate, a plurality of first pixel driving circuits, M first data lines, and M first leads; the base substrate includes a display region and a bonding region; the plurality of first pixel driving circuits are on the base substrate; the display region includes a first region and a second region, and the plurality of first pixel driving circuits are in the second region; the plurality of first pixel driving circuits are arranged in an array to constitute a plurality of first pixel driving columns; the M first data lines are configured to provide data signals to the plurality of first pixel driving columns, the M first leads are respectively connected with the M first data lines, pass through the first region from the second region and extend to the bonding region.

Abstract: In a sensing session establishment process, an access point sends a first frame to a first station, where the first frame includes first information, the first information indicates a first role of the first station in a sensing session, the first role of the first station in the sensing session is a transmitter and/or a receiver, and the first station is a station participating in the sensing session in a second station associated with the access point; and the access point receives a second frame from the first station, where the second frame includes confirm information for the first frame.

Abstract: A display substrate and a preparation method therefor, and a display apparatus are provided. The display substrate includes a display area and a non-display area surrounding the display area, the display area including a first display region, a second display region and a fan-out wiring region, the second display region being located between the first display region and the fan-out wiring region; the first display region including a plurality of first sub-pixels, the first sub-pixel including a first pixel circuit and a first light emitting element; the second display region including a plurality of second sub-pixels, the second sub-pixel including a second pixel circuit and a second light emitting element; the fan-out wiring region including a plurality of data fan-out lines and a plurality of third sub-pixels, the third sub-pixel including a third light emitting element.

Abstract: A display substrate and a display panel are provided. The display substrate includes a base substrate; the base substrate includes a display region and a peripheral region on at least one side of the display region; the peripheral region includes a first peripheral sub-region and a second peripheral sub-region, the display region includes a first display sub-region corresponding to the first peripheral sub-region and a second display sub-region corresponding to the second peripheral sub-region, and the second display sub-region is different from the first display sub-region; the second peripheral sub-region includes a first gate driving circuit, and the first gate driving circuit is configured to be connected to a plurality of gate scanning signal lines in the first display sub-region through a plurality of connecting lines in the display region, to respectively providing a gate scanning signal to a plurality of rows of pixel units in the first display sub-region.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a wireless communication device (WCD) may communicate, during a first communication period, with an audio device via a wireless link configured with a first service interval and a first service period. The WCD may communicate, during a second communication period, with the audio device via the wireless link configured with a second service interval and a second service period based at least in part on detection of a trigger condition comprising one or more of: a change of a signal strength, a change of one or more concurrent wireless links on one or more frequency bands that overlap with the wireless link, a change of a use state of the WCD, or a change in channel congestion or interference. Numerous other aspects are described.

Abstract: A method for detecting an interior condition of a vehicle is provided to use a camera device and a radar device to acquire images and point cloud datasets with respect to an interior space of the vehicle. A computing device generates a synthesized image based on the images and the point cloud datasets, obtains a skeleton feature dataset and a facial feature dataset with respect to a living object in the synthesized image, and determines the interior condition of the vehicle based on the skeleton feature dataset and the facial feature dataset.

Abstract: An array substrate and a display device are disclosed. The array substrate includes a base substrate, a plurality of first pixel driving circuit, a plurality of first data lines and a plurality of first leads; the display region includes a first region and a second region, and the plurality of first pixel driving circuits are located in the second region, the plurality of first pixel driving circuits are arranged in an array to form a plurality of first pixel driving columns, the plurality of first data lines are configured to provide data signals to the plurality of first pixel driving columns, and the plurality of first leads are respectively connected with the plurality of first data lines, pass through the first region from the second region and extend to the bonding region.

Abstract: An aluminum borate whisker reinforced and toughened non-metallic matrix composite is provided, which specifically includes a non-metallic material reinforced and toughened with aluminum borate whiskers. The composite exhibits a higher bending strength and fracture toughness and a higher wear resistance. A method for preparing the composite is also provided. The method includes mixing the aluminum borate whiskers and the non-metallic material to form a mixture; and sintering the mixture by a vacuum hot press method, or molding the mixture.

Abstract: A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

Abstract: The present invention relates to a polybutylene terephthalate composition, comprising (A) 45 to 75% by weight of polybutylene terephthalate, (B) 20 to 45% by weight of at least one carbon fiber, (C) 0 to 20% by weight of at least one solid filler other than the carbon fiber (B), and (D) 0 to 30% by weight of at least one thermoplastic polyester other than polybutylene terephthalate, each being based on the total weight of the polybutylene terephthalate composition, wherein the at least one carbon fiber has a carbon content of 93% by weight or greater, and comprises a sizing agent other than epoxy sizing agent. The present invention also relates to an EMI shielding article produced from the polybutylene terephthalate composition.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, an access point may start a target wake time (TWT) service period (SP). The access point may receive an end of SP (EOSP) indication from a station. The access point may stop the TWT SP before a scheduled end of the TWT SP based on receiving the EOSP indication. Numerous other aspects are described.

Abstract: The system includes a job request collection and distribution module, a scheduling service module and a job execution service module. The job request collection and distribution module receives first description information of a job to be executed from a user terminal. A current scheduling service module matched with a job scheduling algorithm name in at least one scheduling service module determines a computing resource required by the job to be executed according to the first description information, and then determines a job scheduling result according to the required computing resource and currently available cluster computing resources. The job is submitted to a high-performance computer through a current job execution service module matched with a job execution service name in at least one job execution service module according to a device identifier and a global identifier of the job to be executed contained in the scheduling result.

Abstract: A testkey structure for semiconductor device includes a substrate, a gate structure disposed on the substrate, and a plurality of first dummy gate structures disposed on the substrate and arranged around the gate structure. A bottom surface of the gate structure is lower than bottom surfaces of the first dummy gate structures. A top surface of the gate structure is flush with top surfaces of the first dummy gate structures.

Abstract: A preparation method of a bacterial cellulose-defective molybdenum disulfide (BC-MoS2-x) heterojunction material for treating radioactive wastewater is provided, including: preparing bacterial cellulose by the in situ growth technology of Acetobacter xylinum, and freeze-drying to obtain dried bacterial cellulose; carbonizing the dried bacterial cellulose to obtain carbonized bacterial cellulose; dispersing the carbonized bacterial cellulose into deionized water under an ultrasonic treatment; then adding thiourea and Na2MoO4.2H2O, dissolving under an ultrasonic treatment to obtain a reaction mixture, subjecting the reaction mixture to a hydrothermal reaction to obtain a BC-MoS2 heterojunction; and calcining the BC-MoS2 heterojunction in a tube furnace with an Ar/H2 atmosphere to obtain the BC-MoS2-x heterojunction.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: An interventional operation isolation transfer cabin includes a cabin body, and a lead wire access device and a wire in/out device which two are mounted on the cabin body, the cabin body is provided with a negative pressure generating device at one end and an air inlet at the other end, the negative pressure generating device is provided with an exhaust filter device at its air outlet, and an intake filter device is provided at the air inlet. Several operating openings are provided on side walls of the cabin body, each of the operating openings is in seal connection with an operating glove, and a glove opening of at least one operating glove faces an interior of the cabin body. Equipment wires required by an interventional operation are preset through the lead wire access device, and wires added midway under a sealing condition is guaranteed through the wire in/out device.

Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.

Abstract: A rinse-off hair treatment product with a multi-chamber tube package that can contain a dual-phase rinse-off hair treatment composition that can provide a warming sensation and hair conditioning. The multi-chamber tube package can be a tube-in-tube package with an outer tube with an outer chamber that contains a conditioning composition and an inner tube with an inner chamber that contains a warming composition. The inner chamber is fluidly connected to one or more central orifices by an inner nozzle channel and the outer channel is fluidly connected to one or more outer orifices by an outer channel. The ratio of the area of the central orifice(s) to the outer orifice(s) can be greater than 1. The ratios can help the product dispense as a single stream with two visible phases, which has been found to prompt the consumer to intuitively mix the composition, thereby activating a warming sensation.

Abstract: The present disclosure provides an electroplating method, comprising providing an electroplating solution, wherein the electroplating solution includes an effective microorganisms aqueous solution and metal chloride; disposing a workpiece, wherein at least a part of the workpiece is in contact with the electroplating solution; and performing an electroplating process to electroplate metal of the metal chloride onto the workpiece.