Patents by Inventor Rong He GUO

Rong He GUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing semiconductor package structure
    Patent number: 11817421
    Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: November 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yi Dao Wang, Tung Yao Lin, Rong He Guo
  • METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20230230953
    Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.
    Type: Application
    Filed: March 20, 2023
    Publication date: July 20, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi Dao WANG, Tung Yao LIN, Rong He GUO
  • Method for manufacturing semiconductor package structure
    Patent number: 11652081
    Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: May 16, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yi Dao Wang, Tung Yao Lin, Rong He Guo
  • METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20220399303
    Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a substrate, wherein an upper surface of the substrate includes a predetermined region and an energy-absorbing region adjacent to the predetermined region; (b) disposing a first device in the predetermined region of the upper surface of the substrate; and (c) bonding the first device to the substrate by irradiating an upper surface of the first device with an energy-beam, wherein a center of the energy-beam is moved toward the energy-absorbing region from a first position before bonding.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 15, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi Dao WANG, Tung Yao LIN, Rong He GUO
  • METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20220336406
    Abstract: A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.
    Type: Application
    Filed: April 16, 2021
    Publication date: October 20, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yi Dao WANG, Tung Yao LIN, Rong He GUO