Patents by Inventor Rong-Jyun LIN

Rong-Jyun LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240419029
    Abstract: An electronic device includes a light scattering switching element, a light absorbing switching element and a thermal insulation layer. The light absorbing switching element is disposed opposite to the light scattering switching element. The thermal insulation layer is disposed between the light scattering switching element and the light absorbing switching element, wherein the thermal conductivity of the thermal insulation layer is less than 50×10?3 W·m?1·K?1.
    Type: Application
    Filed: May 15, 2024
    Publication date: December 19, 2024
    Inventors: Ming-Che HUANG, Rong-Jyun LIN, I-Wen YANG, Chien-Chih LIU, Ching-Shan LIN, Chi-Chau LIN
  • Patent number: 11988934
    Abstract: An electronic device includes: a first light modulation assembly, including: a first substrate; a second substrate opposite to the first substrate; a first conductive layer disposed on the first substrate; a second conductive layer disposed on the second substrate; a first insulating layer disposed on the first substrate; and a first light modulation layer disposed between the first conductive layer and the second conductive layer.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: May 21, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Bi-Ly Lin, Rong-Jyun Lin, I-Wen Yang, Chih-Chung Hsu
  • Publication number: 20220390786
    Abstract: An electronic device includes: a first light modulation assembly, including: a first substrate; a second substrate opposite to the first substrate; a first conductive layer disposed on the first substrate; a second conductive layer disposed on the second substrate; a first insulating layer disposed on the first substrate; and a first light modulation layer disposed between the first conductive layer and the second conductive layer.
    Type: Application
    Filed: May 17, 2022
    Publication date: December 8, 2022
    Inventors: Bi-Ly LIN, Rong-Jyun LIN, I-Wen YANG, Chih-Chung HSU