Patents by Inventor Rongnan Huang

Rongnan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7333684
    Abstract: This invention relates to a novel stack-integration package of a light emitter and a photodetector in a high speed, full duplex optical transceiver for fiber communications. The structure is comprised of a photodetector chip, having an isolated micromachined cavity on the chip surface, and a light emitter chip, stacked on the bottom surface inside that cavity, so that a stack-integrated embodiment of light detector and emitter capable of performing full duplex optical communication is resulted. Said cavity surface in the photodetector is coated with reflective metal to prevent direct optical crosstalk from the emitter to the photodetector. Said light emitter means either LED (light emitting diode) or LD (laser diode). The present invention is further characterized by having a transparent encapsulation over the stack-integrated embodiment with a specific surface contour that minimizes the Fresnel reflection at the encapsulation-air interface and its associated crosstalk aftereffect.
    Type: Grant
    Filed: March 25, 2004
    Date of Patent: February 19, 2008
    Assignee: Integrated Crystal Technology Incorporated
    Inventors: Jin Shown Shie, Rongnan Huang
  • Publication number: 20050213983
    Abstract: This invention relates to a novel stack-integration package of a light emitter and a photodetector in a high speed, full duplex optical transceiver for fiber communications. The structure is comprised of a photodetector chip, having an isolated micromachined cavity on the chip surface, and a light emitter chip, stacked on the bottom surface inside that cavity, so that a stack-integrated embodiment of light detector and emitter capable of performing full duplex optical communication is resulted. Said cavity surface in the photodetector is coated with reflective metal to prevent direct optical crosstalk from the emitter to the photodetector. Said light emitter means either LED (light emitting diode) or LD (laser diode). The present invention is further characterized by having a transparent encapsulation over the stack-integrated embodiment with a specific surface contour that minimizes the Fresnel reflection at the encapsulation-air interface and its associated crosstalk aftereffect.
    Type: Application
    Filed: March 25, 2004
    Publication date: September 29, 2005
    Inventors: Jin Shie, Rongnan Huang