Patents by Inventor Rong-Yeu Chang

Rong-Yeu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230115965
    Abstract: The present disclosure provides a molding system for fabricating a FRP composite article. The molding system includes a detector, a resin dispenser, a processing module, and a molding machine. The detector is configured to capture a graph of a woven fiber from a top view. The resin dispenser is configured to provide a resin to the woven fiber to form a FRP. The processing module is configured to receive the graph and a plurality of parameters of the FRP. The processing module includes a CNN model, and is configured to use the CNN model to obtain a plurality of predicted mechanical properties of the FRP according to the graph and the plurality of parameters of the FRP. The molding machine is configured to mold the FRP to fabricate the FRP composite article according to the plurality of predicted mechanical properties.
    Type: Application
    Filed: March 10, 2022
    Publication date: April 13, 2023
    Inventors: CHI-HUA YU, MAO-KEN HSU, YI-WEN CHEN, LI-HSUAN SHEN, CHIH-CHUNG HSU, CHIA-HSIANG HSU, RONG-YEU CHANG
  • Patent number: 11602908
    Abstract: The present disclosure provides a method of mesh generation for an RTM process, including operations of: obtaining a geometry of a target object; generating a solid mesh of the target object according to the geometry; obtaining material characteristics of the target object; assembling a runner mesh with the solid mesh, wherein the runner mesh has grid dimensions different from those of the solid mesh; determining process parameters of the RTM process; and generating a forecasted result of the RTM process according to the solid mesh, the runner mesh, the process parameters, and the material characteristics. Generating the solid mesh includes operations of: dividing the geometry into modules; generating a first and second modular meshes corresponding to a first and second modules, wherein the second modular mesh abuts the first modular mesh, and the second modular mesh has grid dimensions different from those of the first modular mesh.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: March 14, 2023
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Ching-Kai Chou, Chien-Ting Wu, Hsun Yang, Li-Hsuan Shen, Chih-Chung Hsu, Chia-Hsiang Hsu, Rong-Yeu Chang
  • Publication number: 20230058453
    Abstract: The present disclosure provides a method of mesh generation for an RTM process, including operations of: obtaining a geometry of a target object; generating a solid mesh of the target object according to the geometry; obtaining material characteristics of the target object; assembling a runner mesh with the solid mesh, wherein the runner mesh has grid dimensions different from those of the solid mesh; determining process parameters of the RTM process; and generating a forecasted result of the RTM process according to the solid mesh, the runner mesh, the process parameters, and the material characteristics. Generating the solid mesh includes operations of: dividing the geometry into modules; generating a first and second modular meshes corresponding to a first and second modules, wherein the second modular mesh abuts the first modular mesh, and the second modular mesh has grid dimensions different from those of the first modular mesh.
    Type: Application
    Filed: December 29, 2021
    Publication date: February 23, 2023
    Inventors: Ching-Kai CHOU, Chien-Ting WU, Hsun YANG, Li-Hsuan SHEN, Chih-Chung HSU, Chia-Hsiang HSU, Rong-Yeu CHANG
  • Patent number: 11521903
    Abstract: The present disclosure provides a method of measuring a plurality of voids in an underfill material of an underfill package. The method includes operations of obtaining a welding angle profile of the underfill package; obtaining a simulated void profile of the underfill package according to the welding angle profile; determining a plurality of high-risk void regions according to the simulated void profile; simulating, according to a selected pressure and a selected temperature of the underfill material, a first high-risk void region of the plurality of high-risk void regions to generate an updated void profile; and determining whether the updated void profile meets a void requirement of the underfill package.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: December 6, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Chien-Ting Wu, Ching-Kai Chou, Kai-Yi Bai, Wei-Yu Lin, Li-Hsuan Shen, Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Publication number: 20220366102
    Abstract: The present disclosure provides an injection molding method and system. The injection molding method includes the operations of: sensing physical parameters associated with an injection molding product; analyzing physical parameters to generate an optimized digital twin model of a physical asset; and producing the injection molding product according to the optimized digital twin model. Analyzing the physical parameters to generate the optimized digital twin model of the physical asset includes operations of: simulating, by a digital twin model, the physical parameters to generate simulated parameters according to first input parameters; validating whether the digital twin model is an optimized digital twin model according to the simulated parameters and the physical parameters; and optimizing the digital twin model to generate the optimized digital twin model when the physical parameters differ from the simulated parameters.
    Type: Application
    Filed: May 2, 2022
    Publication date: November 17, 2022
    Inventors: RONG-YEU CHANG, CHIA-HSIANG HSU, YI-HUI PENG, CHIH-CHUNG HSU, CHUAN-WEI CHANG, PO-YANG YEH
  • Patent number: 11407156
    Abstract: The present disclosure provides an injection-molding system for preparing an injection-molded article using a computer-aided engineering (CAE) simulation. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate a stress distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the stress distribution of the molding resin is generated by taking into consideration an elastic effect of the molding resin; and a controller coupled to the processing module and configured to control the molding machine with the molding condition using the generated stress distribution of the molding resin to perform an actual molding process for preparing the injection-molded article.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: August 9, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11378505
    Abstract: The present disclosure provides a method of measuring an extensional viscosity of a polymer melt and a capillary injection system. The method includes the operations of: based on a weighted GNF viscosity model, obtaining a viscosity profile of the polymer melt according to a transport equation, a Navier Stokes equation, and a Trouton function; measuring a pressure drop of the polymer melt; obtaining a general viscosity of the polymer melt from the viscosity profile according to the pressure drop, wherein the general viscosity comprises a shear viscosity of the polymer melt and the extensional viscosity of the polymer melt; and extracting the extensional viscosity from the general viscosity.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: July 5, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11376777
    Abstract: A molding system includes a molding machine, a mold disposed on the molding machine, a processing module, and a controller operably communicating with the processing module. The molding machine includes a barrel, a screw moving within the barrel, a driving motor driving the screw to move a molding material. The mold has a mold cavity with a die swell structure for being filled with the molding material. The processing module simulating a filling process of the molding material based on a molding condition including a predetermined screw speed for the molding machine, wherein simulating the filling process of the molding material comprises simulating a die swell effect of the molding material in the die swell structure by taking into consideration of an effective factor, a shear viscosity, an extension viscosity, a shear rate, and a molecular orientation effect of the molding material.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: July 5, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Patent number: 11376776
    Abstract: The present disclosure provides a method of measuring a true shear viscosity profile of a molding material in a capillary and a molding system performing the same. The method includes the operations of: determining a setpoint temperature of the molding material before injecting into the capillary; obtaining an initial shear viscosity profile at the setpoint temperature with respect to a shear rate of the molding material; fitting an initial temperature profile with respect to the shear rate according to the initial shear viscosity based on Cross William-Landel-Ferry model; fitting a first shear viscosity profile and a first temperature profile with respect to the shear rate according to the initial temperature profile based on the Cross-WLF model; and setting the first shear viscosity profile as the true shear viscosity profile when a difference between the first temperature profile and the initial temperature profile is not greater than a threshold.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: July 5, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Chen-Chieh Wang, Yu-Ho Wen, Guo-Sian Cyue, Chih-Chung Hsu, Chia-Hsiang Hsu, Rong-Yeu Chang
  • Patent number: 11355361
    Abstract: The present disclosure provides a method for measuring an underfill profile of an underfill material in an underfill cavity having a plurality of solder bumps. The method includes the operations of: determining a mesh having a plurality of elements according to the underfill cavity; calculating a reference force according to the underfill cavity; obtaining a driving force and a flow speed of the underfill material according to a plurality of weighting factors and the reference force, wherein the plurality of weighting factors respectively correspond to the plurality of elements; obtaining a plurality of volume fractions respectively corresponding to the plurality of elements according to the flow speed; and obtaining the underfill profile according to the plurality of volume fractions.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: June 7, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Yu-En Liang, Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Publication number: 20220072750
    Abstract: The present disclosure provides a method of adjusting a dimension of a molded product. The method includes generating a plurality of adjusted molding conditions comprising an adjusted velocity profile and an adjusted packing pressure profile; conducting, via an injection-molding apparatus, an actual molding to produce a molded product using the adjusted molding conditions if the adjusted molding condition is qualified; determining whether a dimension of the molded product needs to be adjusted; and updating at least one of the adjusted molding conditions if the dimension of the molded product needs to be adjusted.
    Type: Application
    Filed: November 22, 2021
    Publication date: March 10, 2022
    Inventors: RONG-YEU CHANG, YUING CHANG, CHIA-HSIANG HSU, TING-YU CHENG
  • Publication number: 20220063166
    Abstract: The present disclosure provides a method of measuring a true shear viscosity profile of a molding material in a capillary and a molding system performing the same. The method includes the operations of: determining a setpoint temperature of the molding material before injecting into the capillary; obtaining an initial shear viscosity profile at the setpoint temperature with respect to a shear rate of the molding material; fitting an initial temperature profile with respect to the shear rate according to the initial shear viscosity based on Cross William-Landel-Ferry model; fitting a first shear viscosity profile and a first temperature profile with respect to the shear rate according to the initial temperature profile based on the Cross-WLF model; and setting the first shear viscosity profile as the true shear viscosity profile when a difference between the first temperature profile and the initial temperature profile is not greater than a threshold.
    Type: Application
    Filed: July 21, 2021
    Publication date: March 3, 2022
    Inventors: CHEN-CHIEH WANG, YU-HO WEN, GUO-SIAN CYUE, CHIH-CHUNG HSU, CHIA-HSIANG HSU, RONG-YEU CHANG
  • Patent number: 11230044
    Abstract: The present disclosure provides a method of producing a molded product. The method comprises steps of performing, via computer-assisted engineering simulation software, a first simulation process to generate a plurality of molding conditions comprising a default injection velocity profile and a default packing pressure profile; conducting, via an injection-molding apparatus, a trial molding to inject a molding material into a mold using the default molding conditions and sensing a plurality of in-mold pressures at different sites in a mold cavity of the mold; and conducting, via an injection-molding apparatus, an actual molding to produce the molded product using the default molding conditions if a deviation of the in-mold pressures at an endpoint of a packing stage is less than a target value.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: January 25, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Rong-Yeu Chang, Yuing Chang, Chia-Hsiang Hsu, Ting-Yu Cheng
  • Patent number: 11230043
    Abstract: A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: January 25, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang
  • Patent number: 11225005
    Abstract: A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: January 18, 2022
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang
  • Publication number: 20210362388
    Abstract: A measuring apparatus of bulk viscosity includes a temperature-controlling cylinder having a test chamber for holding a molding material and at least one piston configured to seal an opening of the temperature-controlling cylinder. The temperature-controlling cylinder and the at least one piston are configured for measuring pressures, specific volumes and temperatures (PVT) of the molding material by applying a plurality of cooling rates to the molding material inside the testing chamber under an isobaric environment, or applying a plurality of mechanical pressures to the molding material inside the testing chamber under an isothermal environment.
    Type: Application
    Filed: August 6, 2021
    Publication date: November 25, 2021
    Inventors: YUAN-JUNG CHANG, RONG-YEU CHANG, CHEN-CHIEH WANG, CHIA-HSIANG HSU
  • Publication number: 20210260804
    Abstract: The present disclosure provides a method of producing a molded product. The method comprises steps of performing, via computer-assisted engineering simulation software, a first simulation process to generate a plurality of molding conditions comprising a default injection velocity profile and a default packing pressure profile; conducting, via an injection-molding apparatus, a trial molding to inject a molding material into a mold using the default molding conditions and sensing a plurality of in-mold pressures at different sites in a mold cavity of the mold; and conducting, via an injection-molding apparatus, an actual molding to produce the molded product using the default molding conditions if a deviation of the in-mold pressures at an endpoint of a packing stage is less than a target value.
    Type: Application
    Filed: December 8, 2020
    Publication date: August 26, 2021
    Inventors: RONG-YEU CHANG, YUING CHANG, CHIA-HSIANG HSU, TING-YU CHENG
  • Patent number: 11065795
    Abstract: The present disclosure provides a molding system for preparing an injection-molded plastic article. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin including a plurality of polymer chains; a processing module configured to generate an anisotropic viscosity distribution of the molding resin in the mold cavity based on a molding condition for the molding machine; wherein the anisotropic viscosity distribution of the molding resin is generated based in part on consideration of an integral effect of a volume fraction and an aspect ratio of the plurality of fibers; and a controller coupled to the processing module and configured to control the molding machine with the molding condition using the generated anisotropic viscosity distribution of the molding resin to perform an actual molding process for preparing the injection-molded plastic article.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: July 20, 2021
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Huan-Chang Tseng, Rong-Yeu Chang, Chia-Hsiang Hsu
  • Publication number: 20210213663
    Abstract: The present disclosure provides a method for deriving a bulk viscosity of a molding material. The method includes a step of deriving a plurality of parameters in relation to pressures, specific volumes and temperatures (PVT) of the molding material under a plurality of cooling rates and a plurality of mechanical pressures; deriving an equilibrium pressure based on the plurality of parameters obtained from a first slowest cooling rate among the plurality of cooling rates; deriving a rate of volume change of the molding material; and obtaining the bulk viscosity of the molding material based on the rate of volume change.
    Type: Application
    Filed: September 14, 2020
    Publication date: July 15, 2021
    Inventors: YUAN-JUNG CHANG, RONG-YEU CHANG, CHEN-CHIEH WANG, CHIA-HSIANG HSU
  • Patent number: D1003928
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: November 7, 2023
    Assignee: CORETECH SYSTEM CO., LTD.
    Inventors: Cheng-Kuang Lee, Chen-Chieh Wang, Chia-Hsiang Hsu, Rong-Yeu Chang