Abstract: A pre-press head may be operated by an operating method. The pre-press head includes an adsorption unit and a control unit. The adsorption unit includes at least two vacuum adsorption structures each including a gas path and at least one gas hole communicated with the gas path. The control unit is configured to control, according to a size of a to-be-adsorbed object, formation of vacuum environment of each vacuum adsorption structure. The adsorption unit is configured to adsorb the to-be-adsorbed object under the control of the control unit. The solution provided by the application adjusts adsorption functions of the vacuum adsorption structures according to a size of a to-be-adsorbed circuit board, so that the pre-press head can be applicable to circuit boards having different sizes.

Abstract: A film feeding apparatus and a control method thereof are provided. The film feeding apparatus comprises a delivery head. A surface of the delivery head has an air suction region and an air blowing region, and the air suction region and the air blowing region respectively include an air hole; and by cooperation of air suctioning through the air hole of the air suction region and air blowing through the air hole of the air blowing region, a film is kept nearby the delivery head in a non-contact manner in the case that the delivery head adsorbs the film.

Abstract: The application discloses a pre-press head and an operating method thereof. The pre-press head includes an adsorption unit and a control unit. The adsorption unit includes at least two vacuum adsorption structures each including a gas path and at least one gas hole communicated with the gas path. The control unit is configured to control, according to a size of a to-be-adsorbed object, formation of vacuum environment of each vacuum adsorption structure. The adsorption unit is configured to adsorb the to-be-adsorbed object under the control of the control unit. The solution provided by the application adjusts adsorption functions of the vacuum adsorption structures according to a size of a to-be-adsorbed circuit board, so that the pre-press head can be applicable to circuit boards having different sizes.

Abstract: A film feeding apparatus and a control method thereof are provided. The film feeding apparatus comprises a delivery head. A surface of the delivery head has an air suction region and an air blowing region, and the air suction region and the air blowing region respectively include an air hole; and by cooperation of air suctioning through the air hole of the air suction region and air blowing through the air hole of the air blowing region, a film is kept nearby the delivery head in a non-contact manner in the case that the delivery head adsorbs the film.