Abstract: Embodiments of this application disclose a hybrid bonding structure and a hybrid bonding method. The hybrid bonding structure includes a first chip and a second chip. A surface of the first chip includes a first insulation dielectric and a first metal, and a first gap area exists between the first metal and the first insulation dielectric. A surface of the second chip includes a second insulation dielectric and a second metal. A surface of the first metal is higher than a surface of the first insulation dielectric. Metallic bonding is formed after the first metal is in contact with the second metal, and the first metal is longitudinally and transversely deformed in the first gap area. Insulation dielectric bonding is formed after the first insulation dielectric is in contact with the second insulation dielectric.

Abstract: This application provides a heat conductor with a large coefficient of thermal conductivity, which can be used to dissipate heat for a semiconductor device, and in particular, may be used in the semiconductor device package field. The heat conductor includes a matrix, and a diamond particle and a first metal nanoparticle that are distributed in the matrix, and an outer surface of the diamond particle successively includes a carbide film layer, a first metal film layer, and a second metal film layer. The three film layers are used to reduce interface thermal resistance between the diamond particle and the first metal nanoparticle. In addition, this application further provides a fluid heat-conducting material and a semiconductor package structure that uses the foregoing heat conductor.

Abstract: Embodiments of this application disclose a hybrid bonding structure and a hybrid bonding method. The hybrid bonding structure includes a first chip and a second chip. A surface of the first chip includes a first insulation dielectric and a first metal, and a first gap area exists between the first metal and the first insulation dielectric. A surface of the second chip includes a second insulation dielectric and a second metal. A surface of the first metal is higher than a surface of the first insulation dielectric. Metallic bonding is formed after the first metal is in contact with the second metal, and the first metal is longitudinally and transversely deformed in the first gap area. Insulation dielectric bonding is formed after the first insulation dielectric is in contact with the second insulation dielectric.

Abstract: Embodiments of the present disclosure disclose a method for base station backhaul, a related device and a system for base station backhaul. The method for base station backhaul includes: modulating data carried on at least two channels to corresponding subcarriers respectively, combining and modulating the subcarriers to a first OFDM signal, sending a first broadband OFDM signal to a remote radio unit, sending, by the remote radio unit, the first broadband OFDM signal to an antenna port after splitting and filtering the same; receiving a second broadband OFDM signal sent by the remote radio unit, demodulating subcarriers included in the second broadband OFDM signal, and sending data obtained by demodulating to corresponding channels respectively. By adopting the present disclosure, a utilization rate of a link channel may be improved, and high-capacity base station backhaul may be achieved under a low cost condition.

Abstract: The present invention provides a filter. The filter includes two common electrode layers and two inner electrode layers, where the two inner electrode layers are located between the two common electrode layers, and an electrical insulation layer is disposed between any two adjacent electrode layers of the two common electrode layers and the two inner electrode layers; each of the two common electrode layers is connected to at least one grounding electrode; and each of the two inner electrode layers is connected to at least one signal electrode. The filter provided by embodiments of the present invention can perform filtering processing on low-frequency noise such as that of a direct current power supply, and has a good filtering processing effect.

Abstract: Embodiments of the present disclosure disclose a method for base station backhaul, a related device and a system for base station backhaul. The method for base station backhaul includes: modulating data carried on at least two channels to corresponding subcarriers respectively, combining and modulating the subcarriers to a first OFDM signal, sending a first broadband OFDM signal to a remote radio unit, sending, by the remote radio unit, the first broadband OFDM signal to an antenna port after splitting and filtering the same; receiving a second broadband OFDM signal sent by the remote radio unit, demodulating subcarriers included in the second broadband OFDM signal, and sending data obtained by demodulating to corresponding channels respectively. By adopting the present disclosure, a utilization rate of a link channel may be improved, and high-capacity base station backhaul may be achieved under a low cost condition.

Abstract: The present invention provides a filter. The filter includes two common electrode layers and two inner electrode layers, where the two inner electrode layers are located between the two common electrode layers, and an electrical insulation layer is disposed between any two adjacent electrode layers of the two common electrode layers and the two inner electrode layers; each of the two common electrode layers is connected to at least one grounding electrode; and each of the two inner electrode layers is connected to at least one signal electrode. The filter provided by embodiments of the present invention can perform filtering processing on low-frequency noise such as that of a direct current power supply, and has a good filtering processing effect.