Patents by Inventor Ronglian Zhang

Ronglian Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL MANAGEMENT OF TIGHTLY INTEGRATED SEMICONDUCTOR DEVICE, SYSTEM AND/OR PACKAGE
    Publication number: 20140022002
    Abstract: Some implementations provide a semiconductor package that includes a first die and a second die adjacent to the first die. The second die is capable of heating the first die. The semiconductor package also includes a leakage sensor configured to measure a leakage current of the first die. The semiconductor package also includes a thermal management unit coupled to the leakage sensor. The thermal management unit configured to control a temperature of the first die based, on the leakage current of the first die.
    Type: Application
    Filed: January 15, 2013
    Publication date: January 23, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Lew G. Chua-Eoan, Ronglian Zhang