Patents by Inventor Rongsheng QI

Rongsheng QI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10768081
    Abstract: A device for implementing a high-temperature plane strain compression test on a thermal simulation tester is provided. High-hardness and special-shaped pressure heads are located at the upper and lower ends of a sample; side shim plates and end shim plates with insulation and high pressure resistance are respectively located in grooves in the end faces and the inner sides of high-strength fixed plates, and the combined fixed plates are respectively located on the left and right sides of the sample; and the combined fixed plates are fixed via four through holes of the fixed plates by high-strength bolts, washers and nuts to limit the plane strain problem caused by the deformation of the sample in the normal direction of the fixed plates.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: September 8, 2020
    Assignee: CITIC Dicastal CO., LTD.
    Inventor: Rongsheng Qi
  • Publication number: 20190293532
    Abstract: A device for implementing a high-temperature plane strain compression test on a thermal simulation tester is provided. High-hardness and special-shaped pressure heads are located at the upper and lower ends of a sample; side shim plates and end shim plates with insulation and high pressure resistance are respectively located in grooves in the end faces and the inner sides of high-strength fixed plates, and the combined fixed plates are respectively located on the left and right sides of the sample; and the combined fixed plates are fixed via four through holes of the fixed plates by high-strength bolts, washers and nuts to limit the plane strain problem caused by the deformation of the sample in the normal direction of the fixed plates.
    Type: Application
    Filed: November 28, 2018
    Publication date: September 26, 2019
    Inventor: Rongsheng QI